A novel electro-thermal model for wide bandgap semiconductor based devices

Nicolae Christian Sintamarean, Frede Blaabjerg, Huai Wang

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Abstract

This paper propose a novel Electro-Thermal Model for the new generation of power electronics WBG-devices (by considering the SiC MOSFET-CMF20120D from CREE), which is able to estimate the device junction and case temperature. The Device-Model estimates the voltage drop and the switching energies by considering the device current, the off-state blocking voltage and junction temperature variation. Moreover, the proposed Thermal-Model is able to consider the thermal coupling within the MOSFET and its freewheeling diode, integrated into the same package, and the influence of the ambient temperature variation. The importance of temperature loop feedback in the estimation accuracy of device junction and case temperature is studied. Furthermore, the Safe Operating Area (SOA) of the SiC MOSFET is determined for 2L-VSI applications which are using sinusoidal PWM. Thus, by considering the heatsink thermal impedance, the switching frequency and the ambient temperature, the maximum allowed drain current is determined according to the thermal limitations of the device. Finally, dynamic study of MOSFET junction and case temperature is also performed by considering the variation of the ambient temperature and of the load current.
OriginalsprogEngelsk
TitelProceedings of the 15th European Conference on Power Electronics and Applications, EPE 2013
Antal sider10
ForlagIEEE Press
Publikationsdato2013
Sider1-10
ISBN (Trykt)9781479901159
ISBN (Elektronisk)9781479901142, 978-147990116-6
DOI
StatusUdgivet - 2013
BegivenhedEuropean Conference on Power Electronics and Applications (EPE) - Lille, Frankrig
Varighed: 2 sep. 20136 sep. 2013
Konferencens nummer: 15

Konference

KonferenceEuropean Conference on Power Electronics and Applications (EPE)
Nummer15
Land/OmrådeFrankrig
ByLille
Periode02/09/201306/09/2013

Emneord

  • Electro-Thermal Model
  • Thermal coupling
  • Junction-Case temperature estimation
  • Thermal Cycling
  • Safe Operation Area

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