Advanced power cycler with intelligent monitoring strategy of IGBT module under test

Publikation: Forskning - peer reviewKonferenceartikel i tidsskrift

Abstract

Power cycling (PC) test is one of the important test methods to assess the reliability performance of power device modules related to packaging technology, in respect to temperature stress. In this paper, an advanced power cycler with a real-time VCE_ON and VF measurement circuit for the IGBT and diode, which for the wear-out condition monitoring are presented. This advanced power cycler allows to perform power cycling test cost-effectively under conditions close to real power converter applications. In addition, an intelligent monitoring strategy for the separation of package-related wear-out failure mechanisms has been proposed. By means of the proposed method, the wear-out failure mechanisms of an IGBT module can be separated without any additional efforts during the power cycling tests. The validity and effectiveness of the proposed monitoring strategy are also verified by experiments.
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Detaljer

Power cycling (PC) test is one of the important test methods to assess the reliability performance of power device modules related to packaging technology, in respect to temperature stress. In this paper, an advanced power cycler with a real-time VCE_ON and VF measurement circuit for the IGBT and diode, which for the wear-out condition monitoring are presented. This advanced power cycler allows to perform power cycling test cost-effectively under conditions close to real power converter applications. In addition, an intelligent monitoring strategy for the separation of package-related wear-out failure mechanisms has been proposed. By means of the proposed method, the wear-out failure mechanisms of an IGBT module can be separated without any additional efforts during the power cycling tests. The validity and effectiveness of the proposed monitoring strategy are also verified by experiments.
OriginalsprogEngelsk
TidsskriftMicroelectronics Reliability
Volume/Bind76-77
Sider (fra-til)522-526
Antal sider5
ISSN0026-2714
DOI
StatusUdgivet - sep. 2017
PublikationsartForskning
Peer reviewJa
Begivenhed28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Bordeaux, Frankrig
Varighed: 25 sep. 201728 sep. 2017

Konference

Konference28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
LandFrankrig
ByBordeaux
Periode25/09/201728/09/2017

Kort

ID: 261538814