A thermoelectric generation system (TEGS) consists of not only thermoelectric modules (TEMs), but also the external load circuitry and the fluidic heat sources. In this paper, a system-level model is proposed in the SPICE-compatible environment to seamlessly integrate the complete fluid-thermal-electric-circuit multiphysics behaviors. Firstly, a quasi one-dimension numerical model for the thermal fluids and their non-uniform temperature distribution as the boundary condition for TEMs is implemented in SPICE using electrothermal analogy. Secondly, the electric field calculation of the previously proposed device-level SPICE model is upgraded to reflect the resistive behaviors of thermoelements, so that the electric connections among spatially distributed TEMs and the load circuitry can be freely combined in the simulation. Thirdly, a hierarchical and TEM-object oriented strategy is developed to make the system modeling and design scalable, flexible, and programmable. To validate the proposed system model, a TEGS including 8 TEMs is constructed. Through comparisons between simulation results and experimental data, it is clear that the cooptimization of the entire TEGS is enabled by the proposed model.