Different I/O Standard and Technology Based Thermal Aware Energy Efficient Vedic Multiplier Design for Green Wireless Communication on FPGA

This paper deals with low power multiplier design that plays a significant role in green wireless communications systems. Over the period of time, researchers have proposed various multiplier designs in order to get high speed. Vedic multiplier is considered as one of the low power multiplier along with high speed as compared with traditional array and booth multipliers. Vedic Multiplier contains a total of sixteen algorithms/sutras for predominantly logical operations. This research focuses on thermal aspects and energy efficiency of wireless communications systems with the thermal aware low power design of Vedic Multiplier. Temperature plays an important role on the performance of any device. The primary purpose of this research is to enhance the thermal stability of the wireless communications. Energy efficient IO standards are used to decrease the power dissipation of Vedic Multiplier and that eventually decrease power dissipation of wireless communications systems. In order to study the effect of different process technology (40, 65, 90 nm) on our design, a novel design is implemented on 40, 65 and 90 nm based FPGA. In this work, we are integrating thermal aware design approach for energy efficient Vedic Multiplier on various FPGA using LVCMOS and HSTL I/O standard. LVCMOS is an acronym for Low Voltage Complementary Metal Oxide Semiconductor and HSTL is an acronym for High Speed Transceiver Logic. In this Vedic Multiplier, we are using three LVCMOS I/O standard and nine HSTL I/O standard. In order to test the thermal sustainability of our Vedic Multiplier design, we are testing it in three different room temperatures i.e. 20, 30, and 40 °C. Using LVCMOS25, there is 12.99, 19.23 and 10.28% reduction in power dissipation on 90, 65 and 40 nm FPGAs respectively. For LVCMOS25, when our Vedic Multiplier design is migrated from 40 nm design to 90 nm FPGA design, there is 87.72% reduction in power dissipation of Vedic Multiplier when temperature is kept constant at 20 °C. When temperature is scaled down from 50 to 20 °C there is 12.45, 14.93, 12.84, 9.45 and 8.48% saving in power dissipation on using HSTL_I, HSTL_I_12, HSTL_I_18, HSTL_I_DCI and HSTL_I_DCI_18 IO Standard respectively on 90 nm FPGA.