Electro-thermal model of power semiconductors dedicated for both case and junction temperature estimation

Ke Ma, Frede Blaabjerg, Marco Liserre

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

14 Citationer (Scopus)

Abstract

The Foster type electro-thermal RC network inside power semiconductor device is normally provided by manufacturers for junction temperature estimation. However it will result in inaccuracy or error when further attaching the Foster network with thermal impedances of heat sink or thermal grease, which are essential components outside power semiconductor devices and will determine the device case temperature level. In order to overcome this unsolved problem, a new thermal model is proposed and verified by simulation in this paper. It is concluded that by the proposed thermal model, it is possible to extend the Foster thermal network inside power semiconductor device, achieving relative more accurate estimation of both junction and case temperature.
OriginalsprogEngelsk
TitelProceedings of PCIM Europe 2013
Antal sider5
ForlagVDE Verlag GMBH
Publikationsdatomaj 2013
Sider1042-1046
ISBN (Trykt)978-3-8007-3505-1
StatusUdgivet - maj 2013
BegivenhedPCIM Europe 2013 - Nuremberg, Tyskland
Varighed: 14 maj 201316 maj 2013

Konference

KonferencePCIM Europe 2013
Land/OmrådeTyskland
ByNuremberg
Periode14/05/201316/05/2013

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