IGBT Module Reliability. Physics-of-Failure based Characterization and Modelling

Kristian Bonderup Pedersen

    Publikation: Ph.d.-afhandling

    3130 Downloads (Pure)
    OriginalsprogEngelsk
    ISBN'er, trykt87-89198-36-1
    StatusUdgivet - dec. 2014

    Citationsformater