Lifetime Prediction of IGBT Modules based on Linear Damage Accumulation

Uimin Choi, Frede Blaabjerg, Ke Ma

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6 Citationer (Scopus)

Abstract

In this paper, the lifetime prediction of power device modules based on the linear damage accumulation in conjunction with real mission profile assessment is studied. Four tests are performed under two superimposed power cycling conditions using an advanced power cycling test setup with 600 V, 30 A, 3-phase molded IGBT modules. The superimposed power cycling conditions are made based on a new lifetime model in respect to junction temperature swing duration, which has been developed based on 39 power cycling test results. The experimental results validate the lifetime prediction of the IGBT modules based on the linear damage accumulation by comparing it with the predicted lifetime from the lifetime model.
OriginalsprogEngelsk
TitelProceedings of the 2017 IEEE Applied Power Electronics Conference and Exposition (APEC)
Antal sider6
ForlagIEEE Press
Publikationsdatomar. 2017
Sider2276-2281
ISBN (Trykt)978-1-5090-5366-7
DOI
StatusUdgivet - mar. 2017
Begivenhed2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa Convention Center, Tampa, FL, USA
Varighed: 26 mar. 201730 mar. 2017

Konference

Konference2017 IEEE Applied Power Electronics Conference and Exposition (APEC)
LokationTampa Convention Center
Land/OmrådeUSA
ByTampa, FL
Periode26/03/201730/03/2017

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