Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates

M. Brincker; P. K. Kristensen; S. Söhl; R. Eisele; V. N. Popok

doi:10.1016/j.microrel.2018.06.051

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates

M. Brincker, P. K. Kristensen, S. Söhl, R. Eisele, V. N. Popok^*

^*Kontaktforfatter

Publikation: Bidrag til tidsskrift › Konferenceartikel i tidsskrift › Forskning › peer review

5 Citationer (Scopus)

Abstract

Transient liquid phase (TLP) bonding is one of novel techniques, which is an alternative to conventional soldering used in power electronics packaging. In this paper, we report on the formation and analysis of TLP bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo systems for production of hybrid metal baseplates. The obtained bonds of intermetallic compounds are characterised by shear testing, optical microscopy and energy dispersive X-ray spectroscopy. Cu-Sn-Mo systems show low bond strength due to severe void and crack formation while Cu-Sn-Ag-Mo interfaces demonstrate high homogeneity and considerable shear strength. Thus, it is concluded that the low temperature TLP bonding using Cu-Sn-Ag-Mo can be a promising candidate for the fabrication of hybrid Cu-Mo baseplates. However, deeper studies of thermal reliability of these systems are required.

Originalsprog	Engelsk
Tidsskrift	Microelectronics Reliability
Vol/bind	88-90
Udgave nummer	September 2018
Sider (fra-til)	774-778
Antal sider	5
ISSN	0026-2714
DOI	https://doi.org/10.1016/j.microrel.2018.06.051
Status	Udgivet - 1 sep. 2018
Begivenhed	29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark Varighed: 1 okt. 2018 → 5 okt. 2018 Konferencens nummer: 29th http://www.esref2018conf.org/

Konference

Konference	29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer	29th
Lokation	AKKC
Land/Område	Danmark
By	Aalborg
Periode	01/10/2018 → 05/10/2018
Internetadresse	http://www.esref2018conf.org/

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Citationsformater

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title = "Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates",

abstract = "Transient liquid phase (TLP) bonding is one of novel techniques, which is an alternative to conventional soldering used in power electronics packaging. In this paper, we report on the formation and analysis of TLP bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo systems for production of hybrid metal baseplates. The obtained bonds of intermetallic compounds are characterised by shear testing, optical microscopy and energy dispersive X-ray spectroscopy. Cu-Sn-Mo systems show low bond strength due to severe void and crack formation while Cu-Sn-Ag-Mo interfaces demonstrate high homogeneity and considerable shear strength. Thus, it is concluded that the low temperature TLP bonding using Cu-Sn-Ag-Mo can be a promising candidate for the fabrication of hybrid Cu-Mo baseplates. However, deeper studies of thermal reliability of these systems are required.",

keywords = "Hybrid metal baseplates, Reliability of interconnects, Transient liquid phase bonding",

author = "M. Brincker and Kristensen, {P. K.} and S. S{\"o}hl and R. Eisele and Popok, {V. N.}",

year = "2018",

month = sep,

day = "1",

doi = "10.1016/j.microrel.2018.06.051",

language = "English",

volume = "88-90",

pages = "774--778",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Pergamon Press",

number = "September 2018",

note = "29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2018 ; Conference date: 01-10-2018 Through 05-10-2018",

url = "http://www.esref2018conf.org/",

}

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates. / Brincker, M.; Kristensen, P. K.; Söhl, S. et al.
I: Microelectronics Reliability, Bind 88-90, Nr. September 2018, 01.09.2018, s. 774-778.

Publikation: Bidrag til tidsskrift › Konferenceartikel i tidsskrift › Forskning › peer review

TY - GEN

T1 - Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects

T2 - 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

AU - Brincker, M.

AU - Kristensen, P. K.

AU - Söhl, S.

AU - Eisele, R.

AU - Popok, V. N.

N1 - Conference code: 29th

PY - 2018/9/1

Y1 - 2018/9/1

N2 - Transient liquid phase (TLP) bonding is one of novel techniques, which is an alternative to conventional soldering used in power electronics packaging. In this paper, we report on the formation and analysis of TLP bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo systems for production of hybrid metal baseplates. The obtained bonds of intermetallic compounds are characterised by shear testing, optical microscopy and energy dispersive X-ray spectroscopy. Cu-Sn-Mo systems show low bond strength due to severe void and crack formation while Cu-Sn-Ag-Mo interfaces demonstrate high homogeneity and considerable shear strength. Thus, it is concluded that the low temperature TLP bonding using Cu-Sn-Ag-Mo can be a promising candidate for the fabrication of hybrid Cu-Mo baseplates. However, deeper studies of thermal reliability of these systems are required.

AB - Transient liquid phase (TLP) bonding is one of novel techniques, which is an alternative to conventional soldering used in power electronics packaging. In this paper, we report on the formation and analysis of TLP bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo systems for production of hybrid metal baseplates. The obtained bonds of intermetallic compounds are characterised by shear testing, optical microscopy and energy dispersive X-ray spectroscopy. Cu-Sn-Mo systems show low bond strength due to severe void and crack formation while Cu-Sn-Ag-Mo interfaces demonstrate high homogeneity and considerable shear strength. Thus, it is concluded that the low temperature TLP bonding using Cu-Sn-Ag-Mo can be a promising candidate for the fabrication of hybrid Cu-Mo baseplates. However, deeper studies of thermal reliability of these systems are required.

KW - Hybrid metal baseplates

KW - Reliability of interconnects

KW - Transient liquid phase bonding

UR - http://www.scopus.com/inward/record.url?scp=85049307715&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.06.051

DO - 10.1016/j.microrel.2018.06.051

M3 - Conference article in Journal

AN - SCOPUS:85049307715

SN - 0026-2714

VL - 88-90

SP - 774

EP - 778

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - September 2018

Y2 - 1 October 2018 through 5 October 2018

ER -

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects: A novel approach for hybrid metal baseplates

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