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Abstract
Thermal management of power electronic devices is essential for reliable performance especially at high power levels. One of the most important activities in the thermal management and reliability improvement is acquiring the temperature information in critical points of the power module. However accurate temperature estimation either vertically or horizontally inside the power devices is still hard to identify. This paper investigates the thermal behavior of high power module in various operating conditions by means of Finite Element Method (FEM). A novel 3D thermal impedance network considering the multi-layer thermal coupling among chips is proposed. The impacts to the thermal impedance by various cooling and heating conditions are also studied. It is concluded that the heating and cooling conditions will have influence on the junction to case thermal impedances and need to be carefully considered in the thermal modelling. The proposed 3D thermal impedance network and the extraction procedure are verified in a circuit simulator and shows to be much faster with the same accuracy compared to FEM simulation. This network can be used for life-time estimation of IGBT module considering the whole converter system and more realistic loading conditions of the device.
Original language | English |
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Title of host publication | Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC) |
Number of pages | 7 |
Publisher | IEEE Press |
Publication date | Mar 2015 |
Pages | 1209-1215 |
ISBN (Print) | 978-1-4799-6735-3 |
DOIs | |
Publication status | Published - Mar 2015 |
Event | 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015 - Charlotte, United States Duration: 15 Mar 2015 → 19 Mar 2015 |
Conference
Conference | 30th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2015 |
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Country/Territory | United States |
City | Charlotte |
Period | 15/03/2015 → 19/03/2015 |
Series | I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings |
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ISSN | 1048-2334 |
Keywords
- Thermal impedance
- Finite element method
- Thermal coupling
- Heating/cooling conditions
- Reliability
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Dive into the research topics of 'A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions'. Together they form a unique fingerprint.Projects
- 1 Finished
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research