Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

Rishita Saini; Neha Bansal; Meenakshi Bansal; Lakshay Kalra; Preet Mohan Singh; Bishwajeet Pandey; Dil Muhammad Akbar Hussain

doi:10.4028/www.scientific.net/AMR.1082.467

Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

Rishita Saini, Neha Bansal, Meenakshi Bansal, Lakshay Kalra, Preet Mohan Singh, Bishwajeet Pandey, Dil Muhammad Akbar Hussain

AAU Energy

Research output: Contribution to journal › Conference article in Journal › Research › peer-review

Abstract

Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.

Original language	English
Journal	Advanced Materials Research
Volume	1082
Pages (from-to)	467-470
Number of pages	4
ISSN	1022-6680
DOIs	https://doi.org/10.4028/www.scientific.net/AMR.1082.467
Publication status	Published - Feb 2015
Event	4th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2014 - Hong Kong, Hong Kong Duration: 19 Oct 2014 → 20 Oct 2014

Conference

Conference	4th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2014
Country/Territory	Hong Kong
City	Hong Kong
Period	19/10/2014 → 20/10/2014

Keywords

Junction Temperature
Ambient Temperature
Leakage Power
Clock Power
I/O Power
Total Power
ROM
Energy Efficient

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Cite this

@inproceedings{5a66ac9c7c434266a07cd3a6e4be909c,

title = "Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA",

abstract = "Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.",

keywords = "Junction Temperature, Ambient Temperature, Leakage Power, Clock Power, I/O Power, Total Power, ROM, Energy Efficient",

author = "Rishita Saini and Neha Bansal and Meenakshi Bansal and Lakshay Kalra and Singh, {Preet Mohan} and Bishwajeet Pandey and Hussain, {Dil Muhammad Akbar}",

year = "2015",

month = feb,

doi = "10.4028/www.scientific.net/AMR.1082.467",

language = "English",

volume = "1082",

pages = "467--470",

journal = "Advanced Materials Research",

issn = "1022-6680",

publisher = "Scientific.Net",

note = "4th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2014 ; Conference date: 19-10-2014 Through 20-10-2014",

}

TY - GEN

T1 - Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

AU - Saini, Rishita

AU - Bansal, Neha

AU - Bansal, Meenakshi

AU - Kalra, Lakshay

AU - Singh, Preet Mohan

AU - Pandey, Bishwajeet

AU - Hussain, Dil Muhammad Akbar

PY - 2015/2

Y1 - 2015/2

N2 - Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.

AB - Thermal aware design is currently gaining importance in VLSI research domain. In this work, we are going to design thermal aware energy efficient ROM on Virtex-5 FPGA. Ambient Temperature, airflow, and heat sink profile play a significant role in thermal aware hardware design life cycle. Ambient temperature is a temperature of surroundings. Airflow is measured in Linear Feet per Minute (LFM). Medium profile and high profile are two different heat sink profile available in XPower analyzer.When frequency goes from 4.0GHz to 1.0GHz, there is 21.8% reduction in clock power, 75% reduction in I/O Power, 35.6% reduction in leakage power and 53.8% reduction in total power at the same frequency.

KW - Junction Temperature

KW - Ambient Temperature

KW - Leakage Power

KW - Clock Power

KW - I/O Power

KW - Total Power

KW - ROM

KW - Energy Efficient

U2 - 10.4028/www.scientific.net/AMR.1082.467

DO - 10.4028/www.scientific.net/AMR.1082.467

M3 - Conference article in Journal

SN - 1022-6680

VL - 1082

SP - 467

EP - 470

JO - Advanced Materials Research

JF - Advanced Materials Research

T2 - 4th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2014

Y2 - 19 October 2014 through 20 October 2014

ER -

Ambient Temperature Based Thermal Aware Energy Efficient ROM Design on FPGA

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Keywords

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