An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

Rui Wu; Francesco Iannuzzo; Huai Wang; Frede Blaabjerg

doi:10.1109/ECCE.2014.6954155

An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

Rui Wu, Francesco Iannuzzo, Huai Wang, Frede Blaabjerg

AAU Energy

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

15 Citations (Scopus)

754 Downloads (Pure)

Abstract

Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.

Original language	English
Title of host publication	Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Number of pages	8
Publisher	IEEE Press
Publication date	Sept 2014
Pages	5502-5509
ISBN (Print)	978-1-4799-5776-7
DOIs	https://doi.org/10.1109/ECCE.2014.6954155
Publication status	Published - Sept 2014
Event	2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, Pittsburgh, United States Duration: 14 Sept 2014 → 18 Sept 2014

Conference

Conference	2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Location	Pittsburgh
Country/Territory	United States
City	Pittsburgh
Period	14/09/2014 → 18/09/2014

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10.1109/ECCE.2014.6954155

An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-CircuitSubmitted manuscript, 783 KB

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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research

2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Huai Wang (Speaker)
14 Sept 2014 → 19 Sept 2014
Activity: Talks and presentations › Conference presentations

Cite this

@inproceedings{452b7deb32514625ad311dabd918d375,

title = "An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit",

abstract = "Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.",

author = "Rui Wu and Francesco Iannuzzo and Huai Wang and Frede Blaabjerg",

year = "2014",

month = sep,

doi = "10.1109/ECCE.2014.6954155",

language = "English",

isbn = "978-1-4799-5776-7",

pages = "5502--5509",

booktitle = "Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE)",

publisher = "IEEE Press",

note = "2014 IEEE Energy Conversion Congress and Exposition (ECCE) ; Conference date: 14-09-2014 Through 18-09-2014",

}

Wu, R, Iannuzzo, F , Wang, H & Blaabjerg, F 2014, An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit. in Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, pp. 5502-5509, 2014 IEEE Energy Conversion Congress and Exposition (ECCE), Pittsburgh, United States, 14/09/2014. https://doi.org/10.1109/ECCE.2014.6954155

An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit. / Wu, Rui; Iannuzzo, Francesco ; Wang, Huai et al.
Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, 2014. p. 5502-5509.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

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T1 - An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

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AU - Iannuzzo, Francesco

AU - Wang, Huai

AU - Blaabjerg, Frede

PY - 2014/9

Y1 - 2014/9

N2 - Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.

AB - Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.

U2 - 10.1109/ECCE.2014.6954155

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M3 - Article in proceeding

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SP - 5502

EP - 5509

BT - Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

PB - IEEE Press

T2 - 2014 IEEE Energy Conversion Congress and Exposition (ECCE)

Y2 - 14 September 2014 through 18 September 2014

ER -

An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

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Projects

Center Of Reliable Power Electronics (CORPE)

Activities

2014 IEEE Energy Conversion Congress and Exposition (ECCE)

Cite this