Projects per year
Abstract
In respect to a Doubly-Fed Induction Generator (DFIG) system, its corresponding time scale varies from microsecond level of power semiconductor switching to second level of the mechanical response. In order to map annual thermal profile of the power semiconductors, different approaches have been adopted to handle the fundamental-frequency thermal cycles and load-varying thermal cycles. Their effects on lifetime estimation of the power device in the Back-to-Back (BTB) power converter are evaluated.
| Original language | English |
|---|---|
| Journal | Microelectronics Reliability |
| Volume | 76-77 |
| Pages (from-to) | 549-555 |
| Number of pages | 7 |
| ISSN | 0026-2714 |
| DOIs | |
| Publication status | Published - Sept 2017 |
| Event | 28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Bordeaux, France Duration: 25 Sept 2017 → 28 Sept 2017 |
Conference
| Conference | 28th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) |
|---|---|
| Country/Territory | France |
| City | Bordeaux |
| Period | 25/09/2017 → 28/09/2017 |
Keywords
- DFIG wind power system
- Lifetime estimation
- Thermal cycles
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- 1 Finished
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APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F., Munk-Nielsen, S., Iannuzzo, F., Wang, H., Uhrenfeldt, C., Beczkowski, S. M., Zhou, D., Choi, U., Jørgensen, A. B., Vernica, I., Sangwongwanich, A., Christensen, N., Ceccarelli, L., Nielsen, C. K., Bahman, A. S., Pedersen, K., Pedersen, K. B. & Kristensen, P. K.
01/01/2017 → 30/06/2021
Project: Research