Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition

Anurag Bose; Joäo Pedro Rodrigues Martins; Sanjay K. Chaudhary; Remus Teodorescu

doi:10.1109/IECON.2017.8216148

Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition

Anurag Bose, Joäo Pedro Rodrigues Martins, Sanjay K. Chaudhary, Remus Teodorescu

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

1 Citation (Scopus)

Abstract

This paper analyzes a 10MW medium voltage Back-to-Back (BTB) Modular Multilevel Converter (MMC) without a DC-Link capacitor with halfbridge submodules. It focusses on the system behavior under single-line-to-ground (SLG) fault when there is no capacitor on the DC-Link.The fault current is computed numerically and compared with the simulated results. The converter control behaviour with regards to the injection of the positive sequence currents in the presence of unbalanced terminal voltages has been investigated. Finally, the converter protection using cell level chopper control strategy is presented to prevent DC overvoltages in the sub-modules during faults.

Original language	English
Title of host publication	Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
Number of pages	6
Publisher	IEEE Press
Publication date	Oct 2017
Pages	858-863
ISBN (Electronic)	978-1-5386-1127-2
DOIs	https://doi.org/10.1109/IECON.2017.8216148
Publication status	Published - Oct 2017
Event	43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 - Beijing, China Duration: 29 Oct 2017 → 1 Nov 2017

Conference

Conference	43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017
Country/Territory	China
City	Beijing
Period	29/10/2017 → 01/11/2017
Sponsor	Chinese Association of Automation (CAA), Chinese Power Supply Society, et al., IEEE Industrial Electronics Society (IES), Systems Engineering Society of China, The Institute of Electrical and Electronics Engineers (IEEE)

Keywords

MMC
Single-line-to-ground fault
Tripping conditions
Chopper

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10.1109/IECON.2017.8216148

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Cite this

@inproceedings{2650c349a86f443b8a67792fcfdf4e94,

title = "Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition",

abstract = "This paper analyzes a 10MW medium voltage Back-to-Back (BTB) Modular Multilevel Converter (MMC) without a DC-Link capacitor with halfbridge submodules. It focusses on the system behavior under single-line-to-ground (SLG) fault when there is no capacitor on the DC-Link.The fault current is computed numerically and compared with the simulated results. The converter control behaviour with regards to the injection of the positive sequence currents in the presence of unbalanced terminal voltages has been investigated. Finally, the converter protection using cell level chopper control strategy is presented to prevent DC overvoltages in the sub-modules during faults.",

keywords = "MMC, Single-line-to-ground fault, Tripping conditions, Chopper",

author = "Anurag Bose and Martins, {Jo{\"a}o Pedro Rodrigues} and Chaudhary, {Sanjay K.} and Remus Teodorescu",

year = "2017",

month = oct,

doi = "10.1109/IECON.2017.8216148",

language = "English",

pages = "858--863",

booktitle = "Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017",

publisher = "IEEE Press",

note = "43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017 ; Conference date: 29-10-2017 Through 01-11-2017",

}

Bose, A, Martins, JPR, Chaudhary, SK & Teodorescu, R 2017, Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition. in Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, pp. 858-863, 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017, Beijing, China, 29/10/2017. https://doi.org/10.1109/IECON.2017.8216148

Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition. / Bose, Anurag; Martins, Joäo Pedro Rodrigues; Chaudhary, Sanjay K. et al.
Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, 2017. p. 858-863.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition

AU - Bose, Anurag

AU - Martins, Joäo Pedro Rodrigues

AU - Chaudhary, Sanjay K.

AU - Teodorescu, Remus

PY - 2017/10

Y1 - 2017/10

N2 - This paper analyzes a 10MW medium voltage Back-to-Back (BTB) Modular Multilevel Converter (MMC) without a DC-Link capacitor with halfbridge submodules. It focusses on the system behavior under single-line-to-ground (SLG) fault when there is no capacitor on the DC-Link.The fault current is computed numerically and compared with the simulated results. The converter control behaviour with regards to the injection of the positive sequence currents in the presence of unbalanced terminal voltages has been investigated. Finally, the converter protection using cell level chopper control strategy is presented to prevent DC overvoltages in the sub-modules during faults.

AB - This paper analyzes a 10MW medium voltage Back-to-Back (BTB) Modular Multilevel Converter (MMC) without a DC-Link capacitor with halfbridge submodules. It focusses on the system behavior under single-line-to-ground (SLG) fault when there is no capacitor on the DC-Link.The fault current is computed numerically and compared with the simulated results. The converter control behaviour with regards to the injection of the positive sequence currents in the presence of unbalanced terminal voltages has been investigated. Finally, the converter protection using cell level chopper control strategy is presented to prevent DC overvoltages in the sub-modules during faults.

KW - MMC

KW - Single-line-to-ground fault

KW - Tripping conditions

KW - Chopper

U2 - 10.1109/IECON.2017.8216148

DO - 10.1109/IECON.2017.8216148

M3 - Article in proceeding

SP - 858

EP - 863

BT - Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017

PB - IEEE Press

T2 - 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017

Y2 - 29 October 2017 through 1 November 2017

ER -

Analysis of Back-to-Back MMC for Medium Voltage Applications under Faulted Condition

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Keywords

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