Thermal analysis of two-level wind power converter under symmetrical grid fault

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

7 Citations (Scopus)
101 Downloads (Pure)

Abstract

In this paper, the case of symmetrical grid fault when using the multi-MW wind turbine of partial-scale and full-scale two-level power converter are designed and investigated. Firstly, the different operation behaviors of the relevant power converters under the voltage dip will be described and analyzed. Simulations of different configurations regarding the loss distribution and the junction temperature of the power device are presented in respect to the various voltage dips. It is concluded that for both systems the power loss will change dramatically during the Low-Voltage Ride Through (LVRT) condition as well as the junction temperature. For the full-scale wind turbine system, the most thermal stressed power device in the grid-side converter will appear at the grid voltage below 0.5 pu, and for the partial-scale wind turbine system, the most thermal stressed power device in the rotor-side converter will appear around 0.6 pu grid voltage.
Original languageEnglish
Title of host publicationProceedings of the 39th Annual Conference of IEEE Industrial Electronics Society, IECON 2013
Number of pages6
PublisherIEEE Press
Publication date2013
Pages1904-1909
ISBN (Print)978-1-4799-0223-1
ISBN (Electronic)978-1-4799-0224-8
DOIs
Publication statusPublished - 2013
Event39th Annual Conference of the IEEE Industrial Electronics Society - Wien, Austria
Duration: 10 Nov 201313 Nov 2013

Conference

Conference39th Annual Conference of the IEEE Industrial Electronics Society
Country/TerritoryAustria
CityWien
Period10/11/201313/11/2013
SeriesProceedings of the Annual Conference of the IEEE Industrial Electronics Society
ISSN1553-572X

Fingerprint

Dive into the research topics of 'Thermal analysis of two-level wind power converter under symmetrical grid fault'. Together they form a unique fingerprint.

Cite this