Abstract
Cooling of electronic equipment is studied. The design size of electronic equipment decrease causing the thermal density to increase. This affect the cooling which can cause for example failures of critical components due to overheating or thermal induced stresses. Initially a pin fin heat sink is considered as extruded profiles are inadequate for compact designs. An optimal pin fin shape and configuration is sought also taking manufacturing costs into consideration. Standard methods for geometrical modeling and thermal analysis are applied.
| Original language | English |
|---|---|
| Title of host publication | The 16th Nordic Seminar on Computational Mechanics - Proceedings |
| Editors | K.M. Mathiesen, T. Kvamsdal, K.M. Okstad |
| Publisher | <Forlag uden navn> |
| Publication date | 2003 |
| Edition | NSCM 16 |
| Pages | 155-158 |
| ISBN (Print) | 8274820665 |
| Publication status | Published - 2003 |
| Event | Nordic Seminar on Computational Mechanics - Trondheim, Norway Duration: 16 Oct 2003 → 18 Oct 2003 Conference number: 16 |
Conference
| Conference | Nordic Seminar on Computational Mechanics |
|---|---|
| Number | 16 |
| Country/Territory | Norway |
| City | Trondheim |
| Period | 16/10/2003 → 18/10/2003 |
Keywords
- computational mechanics
- FEA
- FEM