Abstract
In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.
Original language | English |
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Title of host publication | Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016 |
Number of pages | 7 |
Publisher | IEEE Press |
Publication date | Sept 2016 |
ISBN (Electronic) | 978-1-5090-0737-0 |
DOIs | |
Publication status | Published - Sept 2016 |
Event | 8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, United States Duration: 18 Sept 2016 → 22 Sept 2016 http://www.ieee-ecce.org/ |
Conference
Conference | 8th Annual IEEE Energy Conversion Congress & Exposition |
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Country/Territory | United States |
City | Milwaukee, WI |
Period | 18/09/2016 → 22/09/2016 |
Sponsor | IEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS) |
Internet address |