Effect of Junction Temperature Swing Durations on a Lifetime of a Transfer Molded IGBT Module

Uimin Choi, Frede Blaabjerg, Soren Jorgensen

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

5 Citations (Scopus)

Abstract

In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.
Original languageEnglish
Title of host publicationProceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016
Number of pages7
PublisherIEEE Press
Publication dateSept 2016
ISBN (Electronic)978-1-5090-0737-0
DOIs
Publication statusPublished - Sept 2016
Event 8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, United States
Duration: 18 Sept 201622 Sept 2016
http://www.ieee-ecce.org/

Conference

Conference 8th Annual IEEE Energy Conversion Congress & Exposition
Country/TerritoryUnited States
CityMilwaukee, WI
Period18/09/201622/09/2016
SponsorIEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS)
Internet address

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