Vce-based methods for temperature estimation of high power IGBT modules during power cycling - A comparison

Anastasios Amoiridis, Anup Anurag, Pramod Ghimire, Stig Munk-Nielsen, Nick Baker

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

21 Citations (Scopus)

Abstract

Temperature estimation is of great importance for performance and reliability of IGBT power modules in converter operation as well as in active power cycling tests. It is common to be estimated through Thermo-Sensitive Electrical Parameters such as the forward voltage drop (Vce) of the chip. This experimental work evaluates the validity and accuracy of two Vce based methods applied on high power IGBT modules during power cycling tests. The first method estimates the chip temperature when low sense current is applied and the second method when normal load current is present. Finally, a correction factor that eliminates the series resistance contribution on the Vce measured at high current, is proposed.
Original languageEnglish
Title of host publicationProceedings of the 2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe)
Number of pages9
PublisherIEEE Press
Publication dateSept 2015
DOIs
Publication statusPublished - Sept 2015
Event17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015 - Centre International de Conférence Genève (CICG), 17 rue Varembé CH . 1211 Genève 20, Geneva, Switzerland
Duration: 8 Sept 201510 Sept 2015

Conference

Conference17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015
LocationCentre International de Conférence Genève (CICG), 17 rue Varembé CH . 1211 Genève 20
Country/TerritorySwitzerland
CityGeneva
Period08/09/201510/09/2015

Keywords

  • IGBT high power modules
  • Chip temperature
  • Power cycling
  • Vce measurement
  • IR thermography

Fingerprint

Dive into the research topics of 'Vce-based methods for temperature estimation of high power IGBT modules during power cycling - A comparison'. Together they form a unique fingerprint.

Cite this