Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters

Nick Baker, Marco Liserre, L. Dupont, Y. Avenas

Research output: Contribution to book/anthology/report/conference proceedingArticle in proceedingResearchpeer-review

51 Citations (Scopus)

Abstract

The temperature of a power semiconductor device is important for both its optimal operation and reliability. If the temperature is known during the operation of a converter, it can be used to monitor the health of power modules: a measurement of aging, scheduling of maintenance, or even implementation of active thermal control to reduce losses and increase lifetime can be performed given an accurate knowledge of temperature. Temperature measurements via thermo-sensitive electrical parameters (TSEP) are one way to carry out immediate temperature readings on fully packaged devices. However, successful implementation of these techniques during the actual operation of a device has not yet been achieved. This paper provides an overview of literature where the usage of TSEPs has been hypothesised or realised in realistic power electronic converter setups. Barriers and limitations preventing wider scale implementation of these methods are discussed. Their potential use in the aforementioned goals in condition monitoring and active thermal control is also described.
Original languageEnglish
Title of host publicationProceedings of the 39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013
Number of pages7
PublisherIEEE Press
Publication dateNov 2013
Pages942-948
Article number6699260
ISBN (Print)978-1-4799-0224-8
DOIs
Publication statusPublished - Nov 2013
Event39th Annual Conference of the IEEE Industrial Electronics Society - Wien, Austria
Duration: 10 Nov 201313 Nov 2013

Conference

Conference39th Annual Conference of the IEEE Industrial Electronics Society
Country/TerritoryAustria
CityWien
Period10/11/201313/11/2013
SeriesProceedings of the Annual Conference of the IEEE Industrial Electronics Society
ISSN1553-572X

Keywords

  • Junction temperature
  • Power electronics
  • Power semiconductor devices
  • Temperature measurement
  • Thermo-sensitive electrical parameter (TSEP)

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