Abstract
It is well known that the dynamical change of the thermal stress in the power devices is one of the major factors that have influences on the overall efficiency and reliability of power electronics. The main objective of this paper consists of identifying the main parameters that affect the thermal cycling of power devices in a motor drive application and modelling their impact on the thermal stress. The motor drive system together with the thermal cycling in the power semiconductors have been modelled, and after investigating the dynamic behavior of the system, adverse temperature swings are identified during the acceleration and deceleration periods of the motor. The main causes for these adverse thermal cycles have been presented and, consequently, the influence of the deceleration slope, modulation technique and reactive current on the thermal cycles has been analyzed. Finally, the improved thermal response of the power devices is validated through experimental results.
| Original language | English |
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| Title of host publication | Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016 |
| Number of pages | 8 |
| Publisher | IEEE Press |
| Publication date | Sept 2016 |
| ISBN (Electronic) | 978-1-5090-0737-0 |
| DOIs | |
| Publication status | Published - Sept 2016 |
| Event | 8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, United States Duration: 18 Sept 2016 → 22 Sept 2016 http://www.ieee-ecce.org/ |
Conference
| Conference | 8th Annual IEEE Energy Conversion Congress & Exposition |
|---|---|
| Country/Territory | United States |
| City | Milwaukee, WI |
| Period | 18/09/2016 → 22/09/2016 |
| Sponsor | IEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS) |
| Internet address |
Keywords
- Thermal cycling
- Power losses
- Power semiconductor
- Motor drive