Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography

Pramod Ghimire; Kristian Bonderup Pedersen; Ionut Trintis; Bjørn Rannested; Stig Munk-Nielsen; Paul  Thøgersen

doi:10.1109/ECCE.2015.7310584

Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography

Pramod Ghimire, Kristian Bonderup Pedersen, Ionut Trintis, Bjørn Rannested, Stig Munk-Nielsen, Paul Thøgersen

AAU Energy

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

19 Citations (Scopus)

Abstract

This paper presents on-state collector-emitter voltage (υce, on)-load current (Ic) method to monitor chip temperature on power insulated gate bipolar transistor (IGBT) modules in converter operation. The measurement method is also evaluated using infrared (IR) thermography. Temperature dependencies of υce, on at load current is measured and temperature dependency calibration factor is formulated. This method needs a correction to compensate a deviation in the interconnection resistance from homogeneous temperature field in calibration to non-homogeneous field in loading. The correction parameter is obtained from a static calibration and the method is proposed in the paper. Ageing compensation in estimating the temperature is illustrated. The correction parameter is also analysed in finite element model and also investigated experimentally superimposing heat by conducting device for a longer time in the calibration.

Original language	English
Title of host publication	Proceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE)
Number of pages	8
Publisher	IEEE Press
Publication date	20 Sept 2015
Pages	6602 - 6609
ISBN (Print)	978-1-4673-7151-3
DOIs	https://doi.org/10.1109/ECCE.2015.7310584
Publication status	Published - 20 Sept 2015
Event	2015 IEEE Energy Conversion Congress and Exposition (ECCE) - Montreal, Canada Duration: 20 Sept 2015 → 24 Sept 2015

Conference

Conference	2015 IEEE Energy Conversion Congress and Exposition (ECCE)
Country/Territory	Canada
City	Montreal
Period	20/09/2015 → 24/09/2015

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@inproceedings{5dab211391934be38c2e638d3d959ea9,

title = "Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography",

abstract = "This paper presents on-state collector-emitter voltage (υce, on)-load current (Ic) method to monitor chip temperature on power insulated gate bipolar transistor (IGBT) modules in converter operation. The measurement method is also evaluated using infrared (IR) thermography. Temperature dependencies of υce, on at load current is measured and temperature dependency calibration factor is formulated. This method needs a correction to compensate a deviation in the interconnection resistance from homogeneous temperature field in calibration to non-homogeneous field in loading. The correction parameter is obtained from a static calibration and the method is proposed in the paper. Ageing compensation in estimating the temperature is illustrated. The correction parameter is also analysed in finite element model and also investigated experimentally superimposing heat by conducting device for a longer time in the calibration.",

author = "Pramod Ghimire and Pedersen, {Kristian Bonderup} and Ionut Trintis and Bj{\o}rn Rannested and Stig Munk-Nielsen and Paul Th{\o}gersen",

year = "2015",

month = sep,

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doi = "10.1109/ECCE.2015.7310584",

language = "English",

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booktitle = "Proceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE)",

publisher = "IEEE Press",

note = "2015 IEEE Energy Conversion Congress and Exposition (ECCE) ; Conference date: 20-09-2015 Through 24-09-2015",

}

Ghimire, P, Pedersen, KB, Trintis, I, Rannested, B, Munk-Nielsen, S & Thøgersen, P 2015, Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography. in Proceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, pp. 6602 - 6609 , 2015 IEEE Energy Conversion Congress and Exposition (ECCE), Montreal, Canada, 20/09/2015. https://doi.org/10.1109/ECCE.2015.7310584

Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography. / Ghimire, Pramod; Pedersen, Kristian Bonderup; Trintis, Ionut et al.
Proceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, 2015. p. 6602 - 6609 .

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography

AU - Ghimire, Pramod

AU - Pedersen, Kristian Bonderup

AU - Trintis, Ionut

AU - Rannested, Bjørn

AU - Munk-Nielsen, Stig

AU - Thøgersen, Paul

PY - 2015/9/20

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N2 - This paper presents on-state collector-emitter voltage (υce, on)-load current (Ic) method to monitor chip temperature on power insulated gate bipolar transistor (IGBT) modules in converter operation. The measurement method is also evaluated using infrared (IR) thermography. Temperature dependencies of υce, on at load current is measured and temperature dependency calibration factor is formulated. This method needs a correction to compensate a deviation in the interconnection resistance from homogeneous temperature field in calibration to non-homogeneous field in loading. The correction parameter is obtained from a static calibration and the method is proposed in the paper. Ageing compensation in estimating the temperature is illustrated. The correction parameter is also analysed in finite element model and also investigated experimentally superimposing heat by conducting device for a longer time in the calibration.

AB - This paper presents on-state collector-emitter voltage (υce, on)-load current (Ic) method to monitor chip temperature on power insulated gate bipolar transistor (IGBT) modules in converter operation. The measurement method is also evaluated using infrared (IR) thermography. Temperature dependencies of υce, on at load current is measured and temperature dependency calibration factor is formulated. This method needs a correction to compensate a deviation in the interconnection resistance from homogeneous temperature field in calibration to non-homogeneous field in loading. The correction parameter is obtained from a static calibration and the method is proposed in the paper. Ageing compensation in estimating the temperature is illustrated. The correction parameter is also analysed in finite element model and also investigated experimentally superimposing heat by conducting device for a longer time in the calibration.

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DO - 10.1109/ECCE.2015.7310584

M3 - Article in proceeding

SN - 978-1-4673-7151-3

SP - 6602

EP - 6609

BT - Proceedings of the 2015 IEEE Energy Conversion Congress and Exposition (ECCE)

PB - IEEE Press

T2 - 2015 IEEE Energy Conversion Congress and Exposition (ECCE)

Y2 - 20 September 2015 through 24 September 2015

ER -

Online Chip Temperature Monitoring Using υce-Load Current and IR Thermography

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