Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Amir Sajjad Bahman; Francesco Iannuzzo; Christian Uhrenfeldt; Frede Blaabjerg; Stig Munk-Nielsen

doi:10.1109/ECCE.2016.7855365

Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Amir Sajjad Bahman, Francesco Iannuzzo, Christian Uhrenfeldt, Frede Blaabjerg, Stig Munk-Nielsen

AAU Energy

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

2 Citations (Scopus)

721 Downloads (Pure)

Abstract

In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

Original language	English
Title of host publication	Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016
Number of pages	7
Publisher	IEEE Press
Publication date	Sept 2016
ISBN (Electronic)	978-1-5090-0737-0
DOIs	https://doi.org/10.1109/ECCE.2016.7855365
Publication status	Published - Sept 2016
Event	8th Annual IEEE Energy Conversion Congress & Exposition: ECCE 2016 - Milwaukee, WI, United States Duration: 18 Sept 2016 → 22 Sept 2016 http://www.ieee-ecce.org/

Conference

Conference	8th Annual IEEE Energy Conversion Congress & Exposition
Country/Territory	United States
City	Milwaukee, WI
Period	18/09/2016 → 22/09/2016
Sponsor	IEEE, IEEE Industry Applications Society (IAS), IEEE Power Electronics and Industry Applications Societies (PELS)
Internet address	http://www.ieee-ecce.org/

Keywords

Electro-thermal models
Insulated gate bipolar transistor (IGBT)
Reliability
Short-circuit
Solder fatigue

Access to Document

10.1109/ECCE.2016.7855365

Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT ModulesAccepted author manuscript, 1.82 MB

AUB Link

Search for the material in Aalborg University Library's search engine

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Project: Research

Cite this

@inproceedings{8d79c4e61c8d4608a51d413799ead169,

title = "Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules",

abstract = "In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.",

keywords = "Electro-thermal models, Insulated gate bipolar transistor (IGBT), Reliability, Short-circuit, Solder fatigue",

author = "Bahman, {Amir Sajjad} and Francesco Iannuzzo and Christian Uhrenfeldt and Frede Blaabjerg and Stig Munk-Nielsen",

year = "2016",

month = sep,

doi = "10.1109/ECCE.2016.7855365",

language = "English",

booktitle = "Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016",

publisher = "IEEE Press",

note = " 8th Annual IEEE Energy Conversion Congress & Exposition : ECCE 2016, ECCE 2016 ; Conference date: 18-09-2016 Through 22-09-2016",

url = "http://www.ieee-ecce.org/",

}

Bahman, AS , Iannuzzo, F, Uhrenfeldt, C, Blaabjerg, F & Munk-Nielsen, S 2016, Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules. in Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016. IEEE Press, 8th Annual IEEE Energy Conversion Congress & Exposition, Milwaukee, WI, United States, 18/09/2016. https://doi.org/10.1109/ECCE.2016.7855365

Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules. / Bahman, Amir Sajjad ; Iannuzzo, Francesco; Uhrenfeldt, Christian et al.
Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016. IEEE Press, 2016.

Research output: Contribution to book/anthology/report/conference proceeding › Article in proceeding › Research › peer-review

TY - GEN

T1 - Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

AU - Bahman, Amir Sajjad

AU - Iannuzzo, Francesco

AU - Uhrenfeldt, Christian

AU - Blaabjerg, Frede

AU - Munk-Nielsen, Stig

PY - 2016/9

Y1 - 2016/9

N2 - In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

AB - In this paper, the thermal stress on bond wires of aged IGBT modules under short-circuit conditions has been studied with respect to different solder delamination levels. To ensure repeatable test conditions, ad-hoc DBC (direct bond copper) samples with delaminated solder layers have been purposely fabricated. The temperature distribution produced by such abnormal conditions has been modelled first by means of FEM simulations and then experimentally validated by means of a non-destructive testing technique including an ultra-fast infrared camera. Results demonstrate a significant imbalance in the surface temperature distribution which confirms the hypothesis that short-circuit events produce significantly uneven stresses on bond wires.

KW - Electro-thermal models

KW - Insulated gate bipolar transistor (IGBT)

KW - Reliability

KW - Short-circuit

KW - Solder fatigue

U2 - 10.1109/ECCE.2016.7855365

DO - 10.1109/ECCE.2016.7855365

M3 - Article in proceeding

BT - Proceedings of IEEE Energy Conversion Congress and Exposition (ECCE), 2016

PB - IEEE Press

T2 - 8th Annual IEEE Energy Conversion Congress & Exposition

Y2 - 18 September 2016 through 22 September 2016

ER -

Prediction of Short-Circuit-Related Thermal Stress in Aged IGBT Modules

Abstract

Conference

Keywords

Access to Document

AUB Link

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Projects

Center Of Reliable Power Electronics (CORPE)

Cite this