the International Power Electronics Conference, IPEC-Niigata 2018 -ECCE Asia

Relateret indhold

• Publikationer

• Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter

  Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

• Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

  Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review