• Selma Lagerløfs Vej 312, 1-315

    9220 Aalborg Ø

    Danmark

1993 …2024

Publikationer pr. år

Netværk

Yang Cai

Person: VIP, Ekstern

Abdullah Tahir

Person: VIP, Ekstern

Jian Ren

  • Xidian University

Ekstern person

Yingzeng Yin

  • Xidian University

Ekstern person

Claus Byskov

  • LM Wind Power

Ekstern person

Atsushi Yamamoto

  • Panasonic Holdings Corporation
  • Panasonic

Ekstern person

Xianqi Lin

  • University of Electronic Science and Technology of China

Ekstern person

Xiaoming Chen

  • Qamcom Research & Technology AB
  • Qamcom Research and Technology AB
  • Xi'an Jiaotong University

Ekstern person

Zhugang Wang

  • National Space Science Center, Chinese Academy of Sciences

Ekstern person

Tsutomu Sakata

  • Panasonic Holdings Corporation

Ekstern person

K. Ogawa

  • Panasonic Holdings Corporation

Ekstern person

Atsushi Yamamoto

  • Matsushita Electric Industrial Co., Ltd.
  • Matsushita Electric Industrial Co. Ltd.
  • Network Development Center, Matsushita Electric Industrial Co., Ltd.

Ekstern person

T. Hayashi

  • Panasonic Holdings Corporation

Ekstern person

T. Sakata

  • Panasonic Holdings Corporation

Ekstern person

Jan-Erik Mueller

  • Infineon Technologies AG

Ekstern person

Jia-Lin Li

  • University of Electronic Science and Technology of China

Ekstern person

A. Yamamoto

  • Panasonic Holdings Corporation

Ekstern person

Mikael Knudsen

  • Infineon Technologies Denmark A/S

Ekstern person

Koichi Ogawa

  • Matsushita Electric Industrial Co., Ltd.

Ekstern person

Mattias Gustafsson

  • Huawei Technologies Co., Ltd.

Ekstern person

Yonghui Huang

  • National Space Science Center, Chinese Academy of Sciences

Ekstern person

Koichi Ogawa

  • Panasonic Holdings Corporation

Ekstern person

Xian Qi Lin

  • University of Electronic Science and Technology of China
  • Jiangsu Henxin Technology Co

Ekstern person

Pekka Kyosti

  • Anite Telecoms Oy

Ekstern person

Jinxing Li

  • Huawei Technologies Co., Ltd.

Ekstern person

Jun-ichi Takada

  • Tokyo Institute of Technology

Ekstern person

Naizheng Zheng

  • Aalborg University

Ekstern person

Tommi Jamsa

  • Elektrobit, Oulu
  • Huawei Technologies Co., Ltd.

Ekstern person

Mikael Bergholz Knudsen

  • Infineon Technologies AG

Ekstern person

Toshiteru Hayashi

  • Matsushita Electric Industrial Co., Ltd.

Ekstern person

Abdolali Abdipour

  • Amirkabir University of Technology

Ekstern person

Morten Christensen

  • Molex Interconnect

Ekstern person

Bernd Adler

  • Infineon Technologies AG

Ekstern person

Yonghui Huang

  • CAS - National Space Science Center

Ekstern person

Ying Liu

  • Beijing Jiaotong University

Ekstern person

Thomas Bolin

  • Sony Group Corporation
  • Sony Mobile Communications AB
  • Network Technology
  • Ericsson AB
  • Sony Ericsson Mobile Communications AB

Ekstern person

Morten Christensen

  • Molex Interconnect - Antenna Business Unit

Ekstern person

Toshiteru Hayashi

  • Panasonic Mobile Communications Corporation

Ekstern person

Gerhard Steinbock

  • Huawei Technologies Co., Ltd.

Ekstern person

Mikael B. Knudsen

  • Infineon Technologies Denmark A/S

Ekstern person

Zhinong Ying

  • Sony Group Corporation

Ekstern person

A. Scannavini

  • SATIMO, Pomezia

Ekstern person

Pekka Kyösti

  • Anite Telecoms Oy

Ekstern person

Olof Zander

  • Sony Group Corporation
  • Lund University

Ekstern person

Yiming Zhang

  • Sun Yat-Sen University

Ekstern person

Tianqi ZHANG

  • Chongqing University of Posts and Telecommunications

Ekstern person

Jun-ichi Takada

  • Tokyo Institute of Technology

Ekstern person

Martin Alm

  • Huawei Technologies Co., Ltd.

Ekstern person

Morten Christensen

  • Molex, Antenna Business Unit

Ekstern person

Alex Oprea

  • Lyngsø Systems

Ekstern person

Gerhard Bauch

  • DoCoMo Eurolab

Ekstern person

Peter Bundgaard

  • Infineon Technologies AG

Ekstern person

Lei Wang

  • Hamburg University of Technology
  • Hunan University
  • Yanshan University
  • Soochow University
  • Electric Power Research Institute of State Grid Hebei Electric Power Company

Ekstern person

Morten Christensen

  • EMC Antenna Group, Motorola

Ekstern person

Y. Wu

  • Xi'an Jiaotong University

Ekstern person

Istvan Zsolt Kovacs

  • Nokia Siemens Networks

Ekstern person

Albert Gjedde

  • Aarhus University

Ekstern person

Thomas Kürner

  • Technische Universität Braunschweig

Ekstern person

Jianhua Zhang,

  • Beijing University of Posts and Telecommunications
  • Yanshan University

Ekstern person

Jaouhar Jemai

  • Ubisense AG, Munich

Ekstern person

Niels Kuster

  • Swiss Federal Institute of Technology Zurich

Ekstern person

Koichi Ogawa

  • Tokyo Tech

Ekstern person

Peter S Hall

  • Univ Birmingham

Ekstern person

K. Ogawa

  • Panasonic

Ekstern person

Lars Mølhave

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C
  • Aarhus University

Ekstern person

J. Christiansen

  • GomSpace A/S

Ekstern person

Reza Sarraf Shirazi

  • Amirkabir University of Technology

Ekstern person

Kin Lien Chee

  • Technical University of Braunschweig

Ekstern person

Søren K. Kjærgård

  • Aarhus University

Ekstern person

Qi Liu

  • Hangzhou Dianzi University

Ekstern person

David Pommerenke

  • EMC Laboratory, Missouri University of Science and Technology

Ekstern person

Miakel Bergholz Knudsen

  • Infineon Technologies

Ekstern person

Werner Schroeder

  • University of Applied Sciences Wiesbaden, Rüsselsheim

Ekstern person

Mikael Nilsson

  • Volvo Car Corporation

Ekstern person

Ying Liu

  • University of Copenhagen
  • CAS - Institute of Microbiology
  • Beijing Jiaotong University
  • Swedish University of Agricultural Sciences

Ekstern person

Morten Christensen

  • Molex Interconnect, Antenna Business Unit

Ekstern person

Tong Wu

  • Zhejiang University

Ekstern person

Thomas Kurner

  • Technische Universitet Braunschweig

Ekstern person

Dong-Seek Park

  • Samsung Electronics

Ekstern person

Torben Sigsgaard

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C

Ekstern person

H. Gao

  • Sichuan University

Ekstern person

Martin Jacob

  • Technical University of Braunschweig

Ekstern person

Toshiteru Hayashi

  • Matsushita Electric Industrial Co. Ltd.

Ekstern person

Jari Nurmi

  • Tampere University

Ekstern person

Petar Solic

  • University of Split

Ekstern person

Tim Brown

  • Centre for Communication Systems Research, University of Surrey

Ekstern person

Maja Skiljo

  • University of Split

Ekstern person

Jaouhar Jemai

  • IfN, Braunschweig Technical University

Ekstern person

Aliou Diallo

  • Université de Nice Sophia-Antipolis, LEAT - CNRS UMR

Ekstern person

Mikael Bergholz Knudsen

  • Infineon Tecnologies AG

Ekstern person

A. Morris

  • WiSpry

Ekstern person

Orla Møller Petersen

  • Munin Spot Technologies Aps

Ekstern person

Ibra Dioum

  • Ecole Supérieure Polytechnique - Université Cheikh Anta Diop de Dakar, Département Génie Informatique

Ekstern person

Kristian Karlsson

  • Technical Research Institution of Sweden
  • SP Technical Research Institute of Sweden

Ekstern person

M. Straarup

  • Danfoss AS

Ekstern person

Howard Huang

  • Alcatel-Lucent

Ekstern person

Niels T. Andersen

  • Aarhus University

Ekstern person

Gunter Vermeeren

  • Ghent University

Ekstern person

Mats Gustafsson

  • Lund University
  • Sony Mobile Communications AB
  • Skåne University Hospital

Ekstern person

K. Sakaguchi

  • Graduate School of Science and Engineering, Tokyo Institute of Technology

Ekstern person

Fredrik Tufvesson

  • Lund University

Ekstern person

Toshiteru Hayashi

  • Panasonic Mobile Communications Co., Ltd

Ekstern person

Niels Trolle Andersen

  • Univ Aarhus, Sch Publ Hlth, Dept Biostat, DK-8000 Aarhus

Ekstern person

Koichi Ogawa

  • etwork Development Center, Matsushita Electric Industrial Co., Ltd.

Ekstern person

Anders D Pedersen

  • Hammel Neurorehabil & Res Ctr, Hammel

Ekstern person

Søren K. Christensen

  • Bang & Olufsen A/S

Ekstern person

Pekka Kyösti

  • Anite Telecoms Oy

Ekstern person

Maciej Klemm

  • Univ Bristol

Ekstern person

Gerhard Kristensson

  • Lund University

Ekstern person

Boris Manev

  • Vrije Universiteit Amsterdam

Ekstern person

J Shin

  • WiSpry

Ekstern person

Søren K Kjaergaard

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C

Ekstern person

Wonbin Hong

  • Pohang University of Science and Technology

Ekstern person

Robert Zachariae

  • Aarhus University Hospital

Ekstern person

Changbin Xue

  • CAS - National Space Science Center

Ekstern person

Boyan Yanakiev

  • Molex Antenna Business Unit

Ekstern person

Persefoni Kyritsi

  • European Patent Office

Ekstern person

Yingsong Li

  • Harbin Engineering University

Ekstern person

Lars Bo Hansen

  • LM Wind Power

Ekstern person

L. J. Foged

  • SATIMO, Pomezia

Ekstern person

Tobias Holmgaard

  • Mekoprint

Ekstern person

Bo Ai

  • Peng Cheng Laboratory
  • Zhengzhou University

Ekstern person

Torben Sigsgård

  • Aarhus University

Ekstern person

Bundgaard Peter

  • Infineon Technologies AG

Ekstern person

Chengxiang Wang

  • Heriot-Watt University

Ekstern person

Zoran Blazevic

  • University of Split

Ekstern person

Knud A. Baltsen

  • Bang & Olufsen A/S

Ekstern person

Markus Herdin

  • Rohde&Schwarz

Ekstern person

Maja Stella

  • University of Split

Ekstern person

A. Yamamoto

  • Panasonic

Ekstern person

Yong Fan

  • University of Electronic Science and Technology of China
  • University of Copenhagen

Ekstern person

Cyril Luxey

  • LEAT-CNRS, University of Nice-Sophia Antipolis

Ekstern person

I Dioum

  • Département Génie Informatique, Ecole Supérieure Polytechnique, Université Cheikh Anta Diop de Dakar

Ekstern person

Zuleita Ho

  • Sony Group Corporation

Ekstern person

Ingunn S. Riddervold

  • Aarhus University
  • Prehospital Emergency Medical Services

Ekstern person

Soon L. Ling

  • Vodafone Group Services Limited, Newbury

Ekstern person

Thomas Kürner

  • IfN, Braunschweig Technical University

Ekstern person

Boris Manev

  • Bellona

Ekstern person

Wei Wang

  • Beijing Jiaotong University

Ekstern person

Jianying Li

  • Northwestern Polytechnical University Xian

Ekstern person

Theodoros Samaras

  • University of Thessaloniki

Ekstern person

Do-Young Kim

  • Samsung Electronics, Co. Ltd.

Ekstern person

Mikael Bergholz Knudsen

  • Infineon Technologies

Ekstern person

Kin Lien Chee

  • Technical University of Braunschweig

Ekstern person

Jan Welinder

  • SP Technical Research Institute of Sweden

Ekstern person

Thomas Kurner

  • Technical University of Braunschweig

Ekstern person

Ingunn Skogstad Riddervold

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C
  • Aarhus University

Ekstern person

Kjell Hansson Mild

  • Umeå University

Ekstern person

Gerhard Bauch

  • DoCoMo Euro-Labs

Ekstern person

Arne Møller

  • Aarhus University
  • Sino-Danish Center for Education and Research
  • Aarhus University Hospital

Ekstern person

D. Gerhardt

  • GomSpace A/S

Ekstern person

Cheng-Xiang Wang

  • Southeast University, Nanjing
  • Purple Mountain Laboratories, Nanjing

Ekstern person

Alexandru Tatomirescu

  • Department of Telecommunications
  • Politehnica University of Bucharest

Ekstern person

Tim Brown

  • University of Surrey, Guildford

Ekstern person

Yu-Xiang Sun

  • The College of Electronics and Information Engineering

Ekstern person

Keong Kam

  • EMC Laboratory, Missouri University of Science and Technology

Ekstern person

E. Kuehne

  • Danfoss AS

Ekstern person

Young-Kwon Cho

  • Samsung Electronics CO., LTD
  • Samsung

Ekstern person

Philippe De Doncker

  • Univ Libre, Brussels

Ekstern person

Francescantonio Della Rosa

  • Tampere University

Ekstern person

Yingzheng Yin

  • Xidian University

Ekstern person

Fredrik Tufvesson

  • Lund University

Ekstern person

Xingfeng Wu

  • Huawei Technologies Co., Ltd.

Ekstern person

J. Estrada

  • Satimo, Kennesaw

Ekstern person

J. Takada

  • Graduate School of Science and Engineering, Tokyo Institute of Technology

Ekstern person

Mikael B. Knudsen

  • Infineon Technologies, Denmark A/S

Ekstern person

Sven Kuhn

  • Schmid & Partner Engineering AG

Ekstern person

Raed A. Abd-Alhameed

  • University of Bradford

Ekstern person

ZHENGPENG WANG

  • Beihang University

Ekstern person

Anders D. Pedersen

  • Hammel Research Center

Ekstern person

Martin Jacob

  • Technische Universitet Braunschweig

Ekstern person

Luc Martens

  • Ghent University

Ekstern person

Kun Zhao

  • KTH Royal Institute of Technology

Ekstern person

Lars Mølhave

  • Aarhus University

Ekstern person

Yang Hao

  • Queen Mary Col/Univ London

Ekstern person

Andriy Radchenko

  • EMC Laboratory, Missouri University of Science and Technology

Ekstern person

Andrew Fort

  • Vrije Univ Brussels

Ekstern person

Bo Xu

  • Zhejiang University
  • KTH Royal Institute of Technology
  • Ericsson AB

Ekstern person

Qiuming Zhu

  • Nanjing University of Aeronautics and Astronautics

Ekstern person

Naser Ojaroudiparchin

  • Aalborg University

Ekstern person

Geun-Ho Lee

  • Yonsei University
  • Dankook University

Ekstern person

L. J. Foged

  • SATIMO, Pomezia, Italy & Motorola Mobility Inc., Libertyville

Ekstern person

Tan Yi

  • Heriot-Watt University

Ekstern person

T. Hayashi

  • Pansonic

Ekstern person

Toshiteru Hayashi

  • Communication System Development Center, Panasonic Mobile Communications Co.

Ekstern person

Cyril Luxey

  • Université de Nice Sophia-Antipolis, LEAT - CNRS UMR

Ekstern person

Zhao Xu

  • Huawei Technologies Co., Ltd.

Ekstern person

Morten Christensen

  • Molex Antenna Business Unit

Ekstern person

Gunter Krenz

  • Xtel Aps

Ekstern person

Gholamreza Moradi

  • Amirkabir University of Technology

Ekstern person

Tsutomu Sakata

  • Panasonic

Ekstern person

Robert Zachariae

  • Aarhus Univ Hosp, Psychooncol Res Unit, DK-8000 Aarhus

Ekstern person

Anxue Zhang

  • Xi'an Jiaotong University

Ekstern person

Guido Dietl

  • DoCoMo Euro-Labs

Ekstern person

Debang Liu

  • Chongqing University

Ekstern person

A. Diallo

  • LEAT-CNRS, University of Nice-Sophia Antipolis

Ekstern person