Projekter pr. år
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- 5 Lignende profiler
Insulated gate bipolar transistors (IGBT)
Teknik og materialevidenskab
Thermal stress
Teknik og materialevidenskab
Power electronics
Teknik og materialevidenskab
Finite element method
Teknik og materialevidenskab
Wire
Teknik og materialevidenskab
Switches
Teknik og materialevidenskab
Reliability analysis
Teknik og materialevidenskab
Temperature distribution
Teknik og materialevidenskab
Netværk
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Projekter 2017 2023
X-POWER – Power Electronics Reliability Test Facilities
Blaabjerg, F., Iannuzzo, F., Wang, H., Bahman, A. S., Steffensen, B. & Ravn, T. K.
Styrelsen for Forskning og Uddannelse
01/01/2019 → 31/12/2023
Projekter: Projekt › Forskning
Test facilities
Power electronics
Industry
Life cycle
Lead
APETT: Advanced Power Electronic Technology and Tools
Blaabjerg, F., Munk-Nielsen, S., Iannuzzo, F., Wang, H., Uhrenfeldt, C., Beczkowski, S. M., Zhou, D., Choi, U., Jørgensen, A. B., Vernica, I., Sangwongwanich, A., Christensen, N., Ceccarelli, L., Nielsen, C. K., Bahman, A. S., Pedersen, K., Pedersen, K. B. & Kristensen, P. K.
01/01/2017 → 30/06/2021
Projekter: Projekt › Forskning
Power electronics
Variable speed drives
Electronics industry
Testing
Product design
Modelling and Optimization of the Water Cooling System for the Wind Power Converter
Blaabjerg, F., Wang, H. & Bahman, A. S.
01/04/2017 → 30/03/2018
Projekter: Projekt › Forskning
liquid cooling
quadrants
cooling systems
cooling
optimization
Publikationer 2013 2020
Compact Sandwiched Press-Pack SiC Power Module with Low Stray Inductance and Balanced Thermal Stress
Chang, Y., Luo, H., Iannuzzo, F., Bahman, A. S., Li, W., He, X. & Blaabjerg, F., mar. 2020, I : IEEE Transactions on Power Electronics . 35, 3, s. 2237 - 2241 5 s.Publikation: Bidrag til tidsskrift › Tidsskriftartikel › Forskning › peer review
Thermal stress
Inductance
Busbars
Heat resistance
Cooling
A Busbar Integrated SiC-based Converter with Embedded Heat-pipes
Chang, Y., Bahman, A. S., Luo, H., Li, W., He, X., Iannuzzo, F. & Blaabjerg, F., maj 2019, Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). IEEE Press, s. 2166-2172 7 s. 8796953. (International Conference on Power Electronics).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Busbars
Heat pipes
Packaging
Temperature control
Thermal stress
A Methodology for Rapid Estimation of Junction Temperature of Power Semiconductors Considering Mission Profiles
Alavi, O. & Bahman, A. S., jun. 2019, Proceedings of 2019 IEEE 28th International Symposium on Industrial Electronics (ISIE). IEEE Press, s. 2359-2364 6 s. 8781177. (Industrial Electronics (ISIE), IEEE International Symposium on).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Semiconductor materials
Temperature
Table lookup
Energy conversion
Wind power
A Review: New Designs of Heat Sinks for Flow Boiling Cooling
Nujukambari, A. Y., Bahman, A. S., Hærvig, J. & Sørensen, H., sep. 2019, Proceedings of 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, 6 s. (International Workshop on Thermal Investigations of ICs and Systems).Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Heat sinks
Boiling liquids
Cooling
Microchannels
Coolants
Enhancement of Thermo-mechanical Behavior of IGBT Modules through Engineered Threshold Voltages
Akbari, M., Reigosa, P. D., Bahman, A. S., Ceccarelli, L., Iannuzzo, F. & Bina, M. T., sep. 2019, Proceedings of 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). IEEE Press, 9 s.Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review
Insulated gate bipolar transistors (IGBT)
Threshold voltage
Temperature distribution
Current density
Finite element method