• Pontoppidanstræde 101, 3-014

    9220 Aalborg Ø

    Danmark

20132023
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  • 5 Lignende profiler
Insulated gate bipolar transistors (IGBT) Teknik og materialevidenskab
Thermal stress Teknik og materialevidenskab
Power electronics Teknik og materialevidenskab
Finite element method Teknik og materialevidenskab
Wire Teknik og materialevidenskab
Switches Teknik og materialevidenskab
Reliability analysis Teknik og materialevidenskab
Temperature distribution Teknik og materialevidenskab

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Projekter 2017 2023

Test facilities
Power electronics
Industry
Life cycle
Lead
Power electronics
Variable speed drives
Electronics industry
Testing
Product design
liquid cooling
quadrants
cooling systems
cooling
optimization

Publikationer 2013 2020

Compact Sandwiched Press-Pack SiC Power Module with Low Stray Inductance and Balanced Thermal Stress

Chang, Y., Luo, H., Iannuzzo, F., Bahman, A. S., Li, W., He, X. & Blaabjerg, F., mar. 2020, I : IEEE Transactions on Power Electronics . 35, 3, s. 2237 - 2241 5 s.

Publikation: Bidrag til tidsskriftTidsskriftartikelForskningpeer review

Thermal stress
Inductance
Busbars
Heat resistance
Cooling

A Busbar Integrated SiC-based Converter with Embedded Heat-pipes

Chang, Y., Bahman, A. S., Luo, H., Li, W., He, X., Iannuzzo, F. & Blaabjerg, F., maj 2019, Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). IEEE Press, s. 2166-2172 7 s. 8796953. (International Conference on Power Electronics).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

Busbars
Heat pipes
Packaging
Temperature control
Thermal stress

A Methodology for Rapid Estimation of Junction Temperature of Power Semiconductors Considering Mission Profiles

Alavi, O. & Bahman, A. S., jun. 2019, Proceedings of 2019 IEEE 28th International Symposium on Industrial Electronics (ISIE). IEEE Press, s. 2359-2364 6 s. 8781177. (Industrial Electronics (ISIE), IEEE International Symposium on).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

Semiconductor materials
Temperature
Table lookup
Energy conversion
Wind power

A Review: New Designs of Heat Sinks for Flow Boiling Cooling

Nujukambari, A. Y., Bahman, A. S., Hærvig, J. & Sørensen, H., sep. 2019, Proceedings of 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, 6 s. (International Workshop on Thermal Investigations of ICs and Systems).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

Heat sinks
Boiling liquids
Cooling
Microchannels
Coolants

Enhancement of Thermo-mechanical Behavior of IGBT Modules through Engineered Threshold Voltages

Akbari, M., Reigosa, P. D., Bahman, A. S., Ceccarelli, L., Iannuzzo, F. & Bina, M. T., sep. 2019, Proceedings of 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). IEEE Press, 9 s.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

Insulated gate bipolar transistors (IGBT)
Threshold voltage
Temperature distribution
Current density
Finite element method