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Publikationer 2013 2019

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Konferenceartikel i tidsskrift
2018
1 Citation (Scopus)
10 Downloads (Pure)

Failure mechanism analysis of fuses subjected to manufacturing and operational thermal stresses

Bahman, A. S., Jensen, S. M. & Iannuzzo, F., sep. 2018, I : Microelectronics Reliability. 88-90, s. 304-308 5 s.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

fuses
Electric fuses
thermal stresses
Thermal stress
manufacturing
1 Citation (Scopus)
10 Downloads (Pure)

Thermal modeling of wire-bonded power modules considering non-uniform temperature and electric current interactions

Akbari, M., Bahman, A. S., Reigosa, P. D., Iannuzzo, F. & Tavakoli Bina, M., sep. 2018, I : Microelectronics Reliability. 88-90, s. 1135-1140 6 s.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

Electric currents
electric current
Insulated gate bipolar transistors (IGBT)
wire
Wire
2017
4 Citationer (Scopus)

Reliability-oriented environmental thermal stress analysis of fuses in power electronics

Bahman, A. S., Iannuzzo, F., Holmgaard, T., Nielsen, R. Ø. & Blaabjerg, F., sep. 2017, I : Microelectronics Reliability. 76-77, s. 25-30 6 s.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskriftForskningpeer review

fuses
stress analysis
Electric fuses
thermal stresses
Power electronics