20082024

Publikationer pr. år

Netværk

Yang Cai

Person: VIP, Ekstern

Wen Fu

Person: VIP, Ekstern

Sailing He

  • KTH Royal Institute of Technology

Ekstern person

Kun Zhao

  • KTH Royal Institute of Technology

Ekstern person

Zhinong Ying

  • Sony Group Corporation

Ekstern person

Xiaoming Chen

  • Qamcom Research & Technology AB
  • Qamcom Research and Technology AB
  • Xi'an Jiaotong University

Ekstern person

Claus Byskov

  • LM Wind Power

Ekstern person

Sailing He

  • KTH Royal Institute of Technology
  • Zhejiang University
  • IEEE

Ekstern person

Xianqi Lin

  • University of Electronic Science and Technology of China

Ekstern person

Jia-Lin Li

  • University of Electronic Science and Technology of China

Ekstern person

Xian Qi Lin

  • University of Electronic Science and Technology of China
  • Jiangsu Henxin Technology Co

Ekstern person

Bo Xu

  • Zhejiang University
  • KTH Royal Institute of Technology
  • Ericsson AB

Ekstern person

Yiming Zhang

  • Sun Yat-Sen University

Ekstern person

Thomas Bolin

  • Sony Group Corporation
  • Sony Mobile Communications AB
  • Network Technology
  • Ericsson AB
  • Sony Ericsson Mobile Communications AB

Ekstern person

Qinlong Li

  • The University of Hong Kong
  • Xi'an Jiaotong University

Ekstern person

Guangwei Yang

  • Queen Mary University of London

Ekstern person

Reza Sarraf Shirazi

  • Amirkabir University of Technology

Ekstern person

Yingsong Li

  • Harbin Engineering University

Ekstern person

Qi Liu

  • Zhejiang University
  • University of Kaiserslautern
  • Soochow University
  • Shanghai Jiao Tong University
  • Tianjin University

Ekstern person

Anders Sunesson

  • Lite-On Mobile AB

Ekstern person

Chi-Yuk Chiu

  • Sony Group Corporation
  • Hong Kong University of Science and Technology

Ekstern person

Gholamreza Moradi

  • Amirkabir University of Technology

Ekstern person

Xian Qi Lin

  • University of Electronic Science and Technology of China

Ekstern person

Anxue Zhang

  • Xi’an Jiaotong University

Ekstern person

Wang He

  • Zhejiang University

Ekstern person

Jiang Xiong

  • University of Electronic Science and Technology of China
  • Zhejiang University

Ekstern person

Kun Li

  • Kagawa University

Ekstern person

Olof Zander

  • Sony Group Corporation
  • Lund University

Ekstern person

Buon Kiong Lau

  • Lund University

Ekstern person

Erik Bengtsson

  • Sony Group Corporation
  • Network Technology

Ekstern person

Yuan Zhang

  • South China Normal University, Centre for Opt. and Electromagn. Res., South China Academy of Advanced Optoelectronics
  • South China Normal University

Ekstern person

Abdolali Abdipour

  • Amirkabir University of Technology

Ekstern person

Bo Xu

  • Ericsson AB

Ekstern person

Jianying Li

  • Northwestern Polytechnical University Xian

Ekstern person

Te Pan

  • South China Normal University

Ekstern person

Bangguo Zhu

  • Ericsson AB
  • Sony Group Corporation
  • Northeast Electric Power University

Ekstern person

Buon Kiong Lau

  • Lund University

Ekstern person

Hui Liu

  • South China Normal University, Centre for Opt. and Electromagn. Res., South China Academy of Advanced Optoelectronics

Ekstern person

Faizan Faraz

  • Xi'an Jiaotong University

Ekstern person

Ahmed Kishk

  • Concordia University
  • Concordia University
  • Chalmers University of Technology

Ekstern person

Junlong Li

  • South China Normal University, Centre for Opt. and Electromagn. Res., South China Academy of Advanced Optoelectronics

Ekstern person

Sven Kuhn

  • Schmid & Partner Engineering AG

Ekstern person

Lei Wang

  • Hamburg University of Technology
  • Hunan University
  • Yanshan University
  • Soochow University
  • Electric Power Research Institute of State Grid Hebei Electric Power Company

Ekstern person

Lars Jacob Foged

  • Microwave Vision Group
  • Microwave Vision Italy (MVI)
  • Microwave Vision Group

Ekstern person

Qiao Cheng

  • Queen Mary University of London

Ekstern person

Maxim Zhadobov

  • Université de Rennes

Ekstern person

Muhammad Abdullah

  • Xi'an Jiaotong University

Ekstern person

Qi Liu

  • Hangzhou Dianzi University

Ekstern person

Yang Cai

  • University of Electronic Science and Technology of China

Ekstern person

Wensheng Zhao

  • Hangzhou Dianzi University

Ekstern person

Per Zetterberg

  • KTH Royal Institute of Technology

Ekstern person

Pablo Rosa

  • Polytechnic University of Madrid

Ekstern person

Alessandro Scannavini

  • Microwave Vision Group

Ekstern person

Maryam Faizi Khajeim

  • Amirkabir University of Technology

Ekstern person

Bo Liu

  • University of Glasgow

Ekstern person

Alessandro Scannavini

  • Microwave Vision Group
  • Microwave Vision Italy (MVI)
  • Microwave Vision Group

Ekstern person

Yu Heng Yan

  • University of Electronic Science and Technology of China

Ekstern person

Shaoqiu Xiao

  • Sun Yat-Sen University

Ekstern person

Tian-Yan Lan

  • Sun Yat-Sen University

Ekstern person

Xu Li

  • Sun Yat-Sen University

Ekstern person

Zhi Chen

  • University of Electronic Science and Technology of China

Ekstern person

Lucia Scialacqua

  • Microwave Vision Group
  • Microwave Vision Italy (MVI)

Ekstern person

Qifeng Liu

  • Shanghai Jiao Tong University

Ekstern person

Stanislav Zhekov

  • Ericsson AB

Ekstern person

Steven Gao

  • Chinese University of Hong Kong

Ekstern person

Muhammad Abdullah

  • Engineering Optimization and Modeling Center, Reykjavik University

Ekstern person

Yinliang Diao

  • South China Agricultural University

Ekstern person

Chen Xiaodong

  • Queen Mary University of London

Ekstern person

Wenyan Yin

  • Zhejiang University

Ekstern person

Akimasa Hirata

  • Nagoya Institute of Technology

Ekstern person

Wonbin Hong

  • Pohang University of Science and Technology

Ekstern person

Bo Liu

  • University of Glasgow

Ekstern person

Lars Bo Hansen

  • LM Wind Power

Ekstern person

Katsunori Ishimiya

  • Sony Group Corporation
  • Tokyo Institute of Technology
  • Ericsson AB

Ekstern person

Muhammad Talha Khan

  • University of Electronic Science and Technology of China

Ekstern person

Guangsheng Deng

  • Hefei University of Technology

Ekstern person

Jingtian Xi

  • Foundation for Research on Information Technologies in Society (IT’IS)

Ekstern person

Yichao Liu

  • Taiyuan University of Technology

Ekstern person

Fei Sun

  • Taiyuan University of Technology

Ekstern person

Yong Fan

  • University of Electronic Science and Technology of China
  • University of Copenhagen

Ekstern person

Zheyu Wang

  • University of Electronic Science and Technology of China

Ekstern person

Yufeng Yu

  • No. 36 Research Institute of China Electronics Technology Group Corporation (CETC)

Ekstern person

Zuleita Ho

  • Sony Group Corporation

Ekstern person

Rongjun Liu

  • University of Electronic Science and Technology of China

Ekstern person

Shao Qiu Xiao

  • University of Electronic Science and Technology of China

Ekstern person

Giulia Sacco

  • Université de Rennes

Ekstern person

B. Xu

  • Zhejiang University

Ekstern person

Rickard Ljung

  • Sony Group Corporation

Ekstern person

Qingbi Liao

  • KTH Royal Institute of Technology
  • Ericsson AB

Ekstern person

Miaohui Luo

  • South China Normal University, Centre for Opt. and Electromagn. Res., South China Academy of Advanced Optoelectronics
  • South China Normal University

Ekstern person

Carla Di Paola

  • Ericsson AB

Ekstern person

Fei Sun

  • KTH Royal Institute of Technology
  • Sino-Danish Center for Education and Research
  • University of Chinese Academy of Sciences
  • CAS - Institute of Biophysics

Ekstern person

Yusha Liu

  • Zhejiang University

Ekstern person

Lucia Scialacqua

  • Microwave Vision Group

Ekstern person

Jun Hu

  • Zhejiang University

Ekstern person

Yinfeng Xia

  • Harbin Engineering University

Ekstern person

Qingyuan Wang

  • University of Electronic Science and Technology of China

Ekstern person

Carl Gustafson

  • Lund University
  • Saab AB

Ekstern person

Walid El Hajj

  • Intel Corporation

Ekstern person

Shuomin Zhong

  • Ningbo University

Ekstern person

Xabier Quintana

  • Polytechnic University of Madrid

Ekstern person

Alexander Prokop

  • Dassault Systèmes SIMULIA

Ekstern person

Andrés Alayon Glazunov

  • Chalmers University of Technology

Ekstern person

Nobuo Nakajima

  • The University of Electro-Communications

Ekstern person

Raed A. Abd-Alhameed

  • University of Bradford

Ekstern person

Feng Xiao

  • University of Electronic Science and Technology of China

Ekstern person

Kensuke Sasaki

  • Japan National Institute of Information and Communications Technology

Ekstern person

Zhe Chen

  • University of Electronic Science and Technology of China

Ekstern person

Zhao Xu

  • Huawei Technologies Co., Ltd.

Ekstern person

Jiazhi Tang

  • Xi'an Jiaotong Univ.,
  • Xi'an Jiaotong University

Ekstern person

Sachiko Kodera

  • Nagoya Institute of Technology

Ekstern person

Anxue Zhang

  • Xi'an Jiaotong University

Ekstern person

Robert Guirado

  • Polytechnic University of Madrid

Ekstern person

Mobayode Akinsolu

  • Wrexham Glyndwr University

Ekstern person

Wei Ni

  • Bell Labs, Alcatel-Lucent

Ekstern person

Jiang Zheng

  • Zhejiang University

Ekstern person