Billede af Yi Zhang
  • Pontoppidanstræde 101, 2-052

    9220 Aalborg Ø

    Danmark

20132020

Research output per year

Hvis du har foretaget ændringer i Pure, vil de snart blive vist her.

Publikationer

2020

Artificial Intelligence-Aided Thermal Model Considering Cross-Coupling Effects

Zhang, Y., Wang, Z., Wang, H. & Blaabjerg, F., 2020, (Accepteret/In press) I : IEEE Transactions on Power Electronics.

Publikation: Bidrag til tidsskriftTidsskriftartikel

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7 Downloads (Pure)
2019

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 24 maj 2019, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. USA: IEEE Press, s. 313-318 6 s. 8721785. (IEEE Applied Power Electronics Conference and Exposition (APEC)).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

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30 Downloads (Pure)

A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., dec. 2019, I : IEEE Transactions on Power Electronics. 34, 12, s. 11580 - 11593 14 s., 8678463.

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1 Citationer (Scopus)
103 Downloads (Pure)
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12 Downloads (Pure)

Condition Monitoring for Submodule Capacitors in Modular Multilevel Converters

Wang, H., Wang, H., Wang, Z., Zhang, Y., Pei, X. & Kang, Y., nov. 2019, I : IEEE Transactions on Power Electronics. 34, 11, s. 10403 - 10407 5 s., 8718539.

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4 Citationer (Scopus)
28 Downloads (Pure)

Condition monitoring method for submodule capacitor in modular multilevel converter

Wang, H., Wang, H., Zhang, Y., Wang, Z., Pei, X. & Kang, Y., mar. 2019, Proceedings of 2019 IEEE Annual Applied Power Electronics Conference and Exposition (APEC 2019). IEEE Press, s. 344-348 5 s. (IEEE Applied Power Electronics Conference and Exposition (APEC)).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

10 Downloads (Pure)

Mission Profile Based Adaptive Carrier Frequency Control for Modular Multilevel Converters for Medium Voltage Applications

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., maj 2019, Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia). Korea: IEEE Press, s. 1848-1853 6 s. 8796902. (International Conference on Power Electronics).

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17 Downloads (Pure)

Mission Profile based System-Level Lifetime Prediction of Modular Multilevel Converters

Zhang, Y., 2019, Aalborg Universitetsforlag. 93 s. (Ph.d.-serien for Det Ingeniør- og Naturvidenskabelige Fakultet, Aalborg Universitet).

Publikation: Bog/antologi/afhandling/rapportPh.d.-afhandlingForskning

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14 Downloads (Pure)

Simplified Multi-time Scale Thermal Model Considering Thermal Coupling in IGBT Modules

Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., 24 maj 2019, Proceedings of 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, s. 319-324 6 s. 8721898. (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).

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21 Citationer (Scopus)
581 Downloads (Pure)

System-Level Power Loss Evaluation of Modular Multilevel Converters

Zhang, Y., Wang, H., Wang, Z., Blaabjerg, F. & Saeedifard, M., sep. 2019, 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019. IEEE Press, s. 6797-6804 8 s. 8913051. (IEEE Energy Conversion Congress and Exposition).

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2 Downloads (Pure)
2018

A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., sep. 2018, I : Microelectronics Reliability. 88-90, s. 519-523 5 s.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskrift

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158 Downloads (Pure)

An empirical model for thermal interface materials based on experimental characterizations under realistic conditions

Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., sep. 2018, I : Microelectronics Reliability. 88-90, s. 806-811 6 s.

Publikation: Bidrag til tidsskriftKonferenceartikel i tidsskrift

Balanced Conduction Loss Distribution among SMs in Modular Multilevel Converters

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., 22 okt. 2018, 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, s. 3123-3128 6 s. 8507731

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3 Citationer (Scopus)
139 Downloads (Pure)

Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter

Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., 22 okt. 2018, 2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018. IEEE Press, s. 2743-2749 7 s. 8507408

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

3 Citationer (Scopus)

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Zhang, Y., Wang, H., Wang, Z. & Blaabjerg, F., sep. 2018, Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, s. 6830-6837 8 s.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceabstrakt i proceedingForskningpeer review

2 Citationer (Scopus)

Submodule Level Power Loss Balancing Control for Modular Multilevel Converters

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., sep. 2018, Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE 2018). USA: IEEE Press, s. 5731 - 5736 6 s. (IEEE Energy Conversion Congress and Exposition).

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222 Downloads (Pure)
2017

An Analytical Essential Switching Loss Estimation Method for Modular Multilevel Converters with Nearest Level Modulation

Wang, Z., Wang, H., Zhang, Y. & Blaabjerg, F., okt. 2017, Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, s. 762-767 6 s.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

3 Citationer (Scopus)

Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters

Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., okt. 2017, Proceedings of 2017 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE Press, s. 4202-4207 6 s. (IEEE Energy Conversion Congress and Exposition).

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17 Citationer (Scopus)
231 Downloads (Pure)

Precharge strategies for isolated modular DC-DC converters under two different start-up conditions

Zhang, Y., Wang, H., Li, B., Xu, D. & Blaabjerg, F., jun. 2017, Proceedings of 2017 IEEE 26th International Symposium on Industrial Electronics (ISIE). IEEE Press, s. 1011-1016 6 s.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

2 Citationer (Scopus)

The Impact of Mission Profile Models on the Predicted Lifetime of IGBT Modules in the Modular Multilevel Converter

Zhang, Y., Wang, H., Wang, Z., Yang, Y. & Blaabjerg, F., okt. 2017, Proceedings of 43rd Annual Conference of the IEEE Industrial Electronics Society, IECON 2017. IEEE Press, s. 7980-7985 6 s.

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11 Citationer (Scopus)
178 Downloads (Pure)
2013

Comparison of conventional, parametric and evolutionary optimization approaches for the architectural design of nearly zero energy buildings

Emanuelenaboni, E., MacCarini, A., Korolija, I. & Zhang, Y., 4 nov. 2013, s. 2559-2566. 8 s.

Publikation: Konferencebidrag uden forlag/tidsskriftPaper uden forlag/tidsskriftForskningpeer review

5 Citationer (Scopus)

Extending the use of parametric simulation in practice through a cloud based online service

Naboni, E., Zhang, Y., Maccarini, A., Hirsch, E. & Lezzi, D., 1 jan. 2013, Building Simulation Applications, BSA 2013 - 1st IBPSA Italy Conference. Gasparella, A., Baratieri, M., Corrado, V. & Patuzzi, F. (red.). Free University of Bozen Bolzano, s. 105-112 8 s. (Building Simulation Applications).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

17 Citationer (Scopus)