Billede af Gert Frølund Pedersen

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Gert Frølund Pedersen

Professor

 https://orcid.org/0000-0002-6570-7387

  • Selma Lagerløfs Vej 312, 1-315

    9220 Aalborg Øst

    Danmark

1993 …2025

Publikationer pr. år

Netværk

Shuai Zhang

Person: VIP

Wei Fan

Person: VIP

Jesper Ødum Nielsen

Person: VIP

Ondrej Franek

Person: VIP

Ming Shen

Person: VIP

Kim Olesen

Person: TAP

Patrick Claus Friedrich Eggers

Person: TAP

Fengchun Zhang

Person: VIP

Peng Mei

Person: VIP

Igor Aleksandrovich Syrytsin

Person: DVIP, VIP

Ivan Bonev Bonev

Person: VIP

Zhaohui Wei

Person: VIP

Zhao Zhou

Person: VIP

Rocio Rodriguez Cano

Person: VIP

Petar Popovski

Person: VIP

Ole Kiel Jensen

Person: VIP

Daniel E. Serup

Person: VIP

Zhinong Ying

Person: VIP

Hans Ebert

Person: VIP

Rasmus Krigslund

Person: DVIP

Peng Wang

Person: VIP

Jan H. Mikkelsen

Person: VIP

Ming Yao

Person: VIP, Ekstern

Ben Krøyer

Person: TAP

Markus Winther Frost

Person: Tilknyttet Aalborg UH

Søren Kold

Person: Tilknyttet Aalborg UH, VIP

Yang Cai

Person: VIP, Ekstern

Zhiqiang Yuan

Person: VIP

Preben E. Mogensen

Person: VIP

Yifa Li

Person: VIP

Wen Fu

Person: VIP

Abdullah Tahir

Person: DVIP, VIP

Ole Rahbek

Person: Tilknyttet Aalborg UH, VIP

Troels Pedersen

Person: VIP

Kristian Henriksen Bank

Person: TAP

Torben Larsen

Person: VIP

Peyman Aghabeyki

Person: VIP

Yubo Wang

Person: VIP

Qirui Hua

Person: VIP

Jakob Lund Dideriksen

Person: VIP

Robin Jess Williams

Person: VIP

Cedomir Stefanovic

Person: VIP

Ying Sun

Person: VIP

Arash Ghaffari

Person: Tilknyttet Aalborg UH, TAP

Lasse Riis Østergaard

Person: VIP

Mengting Li

Person: VIP

Iskra Dukovska-Popovska

Person: VIP

Pekka Kyösti

Ekstern person

Jian Ren

  • Xidian University

Ekstern person

Simon Svendsen

  • Intel

Ekstern person

Yingzeng Yin

  • Xidian University

Ekstern person

Art Morris

  • WiSpry

Ekstern person

Xavier Carreño

  • Intel

Ekstern person

Yuanan Liu

  • Beijing University of Posts and Telecommunications

Ekstern person

Lassi Hentilä

Ekstern person

Peter Bundgaard

  • Intel

Ekstern person

Claus Byskov

  • LM Wind Power

Ekstern person

Atsushi Yamamoto

  • Panasonic Holdings Corporation
  • Panasonic

Ekstern person

Weiming Wang

Ekstern person

M.B. Knudsen

Ekstern person

Xianqi Lin

  • University of Electronic Science and Technology of China

Ekstern person

Mikael Knudsen

  • Intel

Ekstern person

Poul Olesen

  • Intel

Ekstern person

Panawit Hanpinitsak

Ekstern person

Xiaoming Chen

  • Qamcom Research & Technology AB
  • Qamcom Research and Technology AB
  • Xi'an Jiaotong University

Ekstern person

Ole Jagielski

  • Intel

Ekstern person

Yongle Wu

Ekstern person

Tsutomu Sakata

  • Panasonic Holdings Corporation

Ekstern person

Poul Olesen

Ekstern person

Kentaro SAITO

Ekstern person

Yongle Wu

  • Beijing University of Posts and Telecommunications

Ekstern person

K. Ogawa

  • Panasonic Holdings Corporation

Ekstern person

Zhugang Wang

  • National Space Science Center, Chinese Academy of Sciences

Ekstern person

Atsushi Yamamoto

  • Matsushita Electric Industrial Co., Ltd.
  • Matsushita Electric Industrial Co. Ltd.
  • Network Development Center, Matsushita Electric Industrial Co., Ltd.

Ekstern person

T. Hayashi

  • Panasonic Holdings Corporation

Ekstern person

T. Sakata

  • Panasonic Holdings Corporation

Ekstern person

Jan-Erik Mueller

  • Infineon Technologies AG

Ekstern person

Jia-Lin Li

  • University of Electronic Science and Technology of China

Ekstern person

A. Yamamoto

  • Panasonic Holdings Corporation

Ekstern person

Tao Hong

  • Xidian University

Ekstern person

Mikael Knudsen

  • Infineon Technologies Denmark A/S

Ekstern person

Koichi Ogawa

  • Matsushita Electric Industrial Co., Ltd.

Ekstern person

José Rodríguez-Piñeiro

  • Tongji University

Ekstern person

mikael knudsen

  • Infineon

Ekstern person

Junichi Takada

Ekstern person

Mattias Gustafsson

  • Huawei Technologies Co., Ltd.

Ekstern person

Wen Jiang

  • Xidian University

Ekstern person

Yonghui Huang

  • National Space Science Center, Chinese Academy of Sciences

Ekstern person

Arthur S. Morris

  • WiSpry

Ekstern person

Koichi Ogawa

  • Panasonic Holdings Corporation

Ekstern person

Xian Qi Lin

  • University of Electronic Science and Technology of China
  • Jiangsu Henxin Technology Co

Ekstern person

Jian Ren

Ekstern person

Pekka Kyosti

  • Anite Telecoms Oy
  • Keysight Technologies
  • University of Oulu

Ekstern person

Jinxing Li

  • Huawei Technologies Co., Ltd.

Ekstern person

Del Barrio Samantha Caporal

Ekstern person

Jun-ichi Takada

  • Tokyo Institute of Technology

Ekstern person

Naizheng Zheng

  • Aalborg University

Ekstern person

Mikael B. Knudsen

  • Intel

Ekstern person

Søren Skjærris

Ekstern person

Tommi Jamsa

  • Elektrobit, Oulu
  • Huawei Technologies Co., Ltd.

Ekstern person

Jagjit Ashta

  • Intel

Ekstern person

Mikael Bergholz Knudsen

  • Infineon Technologies AG

Ekstern person

Toshiteru Hayashi

  • Matsushita Electric Industrial Co., Ltd.

Ekstern person

Abdolali Abdipour

  • Amirkabir University of Technology

Ekstern person

Tommi Jämsä

Ekstern person

Morten Christensen

  • Molex Interconnect

Ekstern person

Ole Jagielski

Ekstern person

Barrio Samantha Caporal Del

Ekstern person

Bernd Adler

  • Infineon Technologies AG

Ekstern person

Boyan Yanakiev

  • Intel

Ekstern person

Ying Liu

  • Beijing Jiaotong University

Ekstern person

Thomas Bolin

  • Sony Group Corporation
  • Sony Mobile Communications AB
  • Network Technology
  • Ericsson AB
  • Sony Ericsson Mobile Communications AB

Ekstern person

Pekka Kyösti

  • University of Oulu
  • Keysight Technologies

Ekstern person

Morten Christensen

  • Molex Interconnect - Antenna Business Unit

Ekstern person

Toshiteru Hayashi

  • Panasonic Mobile Communications Corporation

Ekstern person

Gerhard Steinbock

  • Huawei Technologies Co., Ltd.

Ekstern person

Mikael B. Knudsen

  • Infineon Technologies Denmark A/S

Ekstern person

Jianhua Zhang,

  • Beijing University of Posts and Telecommunications
  • Yanshan University

Ekstern person

G.F.L. Pedersen

Ekstern person

Zhinong Ying

  • Sony Group Corporation

Ekstern person

Saito Kentaro

Ekstern person

Mikael B. Knudsen

  • Intel

Ekstern person

A. Scannavini

  • SATIMO, Pomezia

Ekstern person

Pekka Kyösti

  • Anite Telecoms Oy

Ekstern person

Chao Luo

  • CAS - Aerospace Information Research Institute

Ekstern person

S. Svendsen

Ekstern person

Zhenning Li

  • CAS - Aerospace Information Research Institute

Ekstern person

Olof Zander

  • Sony Group Corporation
  • Lund University

Ekstern person

Tong Wu

  • Zhejiang University

Ekstern person

Zhengpeng Wang

Ekstern person

Jun Wang

  • iCarbonX
  • China Agricultural University
  • University of Copenhagen
  • Macau University of Science and Technology
  • BGI-Shenzhen
  • Anhui Polytechnic University
  • Henan University of Technology

Ekstern person

Nanxin Wang

Ekstern person

Yiming Zhang

  • Sun Yat-Sen University

Ekstern person

Tianqi ZHANG

  • Chongqing University of Posts and Telecommunications

Ekstern person

B.G.H. Olsson

Ekstern person

Moray Rumney

Ekstern person

J.G. Thomsen

Ekstern person

Zhengpeng Wang

  • Beihang University

Ekstern person

Jun-ichi Takada

  • Tokyo Institute of Technology

Ekstern person

Panawit HANPINITSAK

Ekstern person

Saito Kentaro

Ekstern person

Martin Alm

  • Huawei Technologies Co., Ltd.

Ekstern person

Yonghui Huang

  • CAS - National Space Science Center

Ekstern person

Baoze Ma

  • Chongqing University of Posts and Telecommunications

Ekstern person

Morten Christensen

  • Molex, Antenna Business Unit

Ekstern person

Antonio Pérez Yuste

Ekstern person

G. Pedersen

Ekstern person

bihua tang

Ekstern person

Alex Oprea

  • Lyngsø Systems

Ekstern person

Naser Ojaroudiparchin

  • Aalborg University

Ekstern person

Mikael Knudsen

  • Intel

Ekstern person

Gerhard Bauch

  • DoCoMo Eurolab

Ekstern person

Peter Bundgaard

  • Infineon Technologies AG

Ekstern person

Lei Wang

  • Hamburg University of Technology
  • Hunan University
  • Yanshan University
  • Soochow University
  • Electric Power Research Institute of State Grid Hebei Electric Power Company
  • Heriot-Watt University

Ekstern person

Qiuming Zhu

Ekstern person

M. D. Foegelle

Ekstern person

Morten Christensen

  • EMC Antenna Group, Motorola

Ekstern person

Y. Wu

  • Xi'an Jiaotong University

Ekstern person

Jørgen Bøjer

Ekstern person

Istvan Zsolt Kovacs

  • Nokia Siemens Networks

Ekstern person

M.B. Knnudsen

Ekstern person

Albert Gjedde

  • Aarhus University

Ekstern person

Thomas Kürner

  • Technische Universität Braunschweig

Ekstern person

Jaouhar Jemai

  • Ubisense AG, Munich

Ekstern person

Niels Kuster

  • Swiss Federal Institute of Technology Zurich

Ekstern person

Yonghui Huang

Ekstern person

Jagjit ashta

Ekstern person

Le Hao

Ekstern person

Koichi Ogawa

  • Tokyo Tech

Ekstern person

Ole Jagielski

  • Intel

Ekstern person

Peter S Hall

  • Univ Birmingham

Ekstern person

Pierre Jacolot

  • Intel

Ekstern person

Christian Drewes

  • Intel

Ekstern person

K. Ogawa

  • Panasonic

Ekstern person

Lars Mølhave

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C
  • Aarhus University

Ekstern person

Jagjit S. Ashta

  • Intel

Ekstern person

J. Christiansen

  • GomSpace A/S

Ekstern person

Aki Hekkala

Ekstern person

Reza Sarraf Shirazi

  • Amirkabir University of Technology

Ekstern person

Kin Lien Chee

  • Technical University of Braunschweig

Ekstern person

SAMSUNG Electronics CO LTD

  • Samsung

Ekstern person

H.L. Bertoni

Ekstern person

Mikael B. Knudsen

  • Intel

Ekstern person

xiumin song

Ekstern person

S.B. Brink

Ekstern person

Marcus Pendergrass

Ekstern person

Søren K. Kjærgård

  • Aarhus University

Ekstern person

Jianhua Zhang

Ekstern person

Yiming Zhang

Ekstern person

Qi Liu

  • Hangzhou Dianzi University

Ekstern person

David Pommerenke

  • EMC Laboratory, Missouri University of Science and Technology

Ekstern person

Jingxiang Hong

Ekstern person

Miakel Bergholz Knudsen

  • Infineon Technologies

Ekstern person

Werner Schroeder

  • University of Applied Sciences Wiesbaden, Rüsselsheim

Ekstern person

Mikael Nilsson

  • Volvo Car Corporation

Ekstern person

Ying Liu

  • University of Copenhagen
  • CAS - Institute of Microbiology
  • Beijing Jiaotong University
  • Swedish University of Agricultural Sciences

Ekstern person

Lizhu Meng

Ekstern person

Morten Christensen

  • Molex Interconnect, Antenna Business Unit

Ekstern person

M. Tartiere

Ekstern person

Tong Wu

  • Zhejiang University

Ekstern person

Thomas Kurner

  • Technische Universitet Braunschweig

Ekstern person

Tommaso Balercia

  • Intel

Ekstern person

Sumit Roy

Ekstern person

Dong-Seek Park

  • Samsung Electronics

Ekstern person

Torben Sigsgaard

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C

Ekstern person

H. Gao

  • Sichuan University

Ekstern person

K.V. Steffensen

Ekstern person

Martin Jacob

  • Technical University of Braunschweig

Ekstern person

Toshiteru Hayashi

  • Matsushita Electric Industrial Co. Ltd.

Ekstern person

Istvan Kovacs

Ekstern person

Bo Skjoldborg

Ekstern person

Jari Nurmi

  • Tampere University

Ekstern person

Miakel B. Knudsen

  • Intel

Ekstern person

Petar Solic

  • University of Split

Ekstern person

P Cumming

Ekstern person

Benzhe Ning

Ekstern person

Weimin Wang

Ekstern person

M. Klemm

Ekstern person

G. Troster

Ekstern person

O. Jagielski

Ekstern person

Peter Madsen

  • WiSpry

Ekstern person

Tim Brown

  • Centre for Communication Systems Research, University of Surrey

Ekstern person

Maja Skiljo

  • University of Split

Ekstern person

Jaouhar Jemai

  • IfN, Braunschweig Technical University

Ekstern person

Aliou Diallo

  • Université de Nice Sophia-Antipolis, LEAT - CNRS UMR

Ekstern person

Puchu Li

Ekstern person

Robert Qiu

Ekstern person

Mikael Bergholz Knudsen

  • Infineon Tecnologies AG

Ekstern person

Tommy NIELSEN

Ekstern person

Xuesong Cai

Ekstern person

A. Morris

  • WiSpry

Ekstern person

Orla Møller Petersen

  • Munin Spot Technologies Aps

Ekstern person

Ibra Dioum

  • Ecole Supérieure Polytechnique - Université Cheikh Anta Diop de Dakar, Département Génie Informatique

Ekstern person

A Roepstorff

Ekstern person

Kristian Karlsson

  • Technical Research Institution of Sweden
  • SP Technical Research Institute of Sweden

Ekstern person

M. Straarup

  • Danfoss AS

Ekstern person

Howard Huang

  • Alcatel-Lucent

Ekstern person

Jukka-Pekka Nuutinen

Ekstern person

Jagjit S. Ashta

  • Intel

Ekstern person

Niels T. Andersen

  • Aarhus University

Ekstern person

J. Brøndum

Ekstern person

Heng Wang

Ekstern person

Zhiqin Wang

Ekstern person

N. Rots

Ekstern person

Gunter Vermeeren

  • Ghent University

Ekstern person

Fredrik Tufvesson

Ekstern person

Wei Fan

Ekstern person

Mats Gustafsson

  • Lund University
  • Sony Mobile Communications AB
  • Skåne University Hospital

Ekstern person

K. Sakaguchi

  • Graduate School of Science and Engineering, Tokyo Institute of Technology

Ekstern person

Xavier CARRENO

Ekstern person

Yi Tang

Ekstern person

Fredrik Tufvesson

  • Lund University

Ekstern person

Toshiteru Hayashi

  • Panasonic Mobile Communications Co., Ltd

Ekstern person

Niels Trolle Andersen

  • Univ Aarhus, Sch Publ Hlth, Dept Biostat, DK-8000 Aarhus

Ekstern person

Koichi Ogawa

  • etwork Development Center, Matsushita Electric Industrial Co., Ltd.

Ekstern person

Anders D Pedersen

  • Hammel Neurorehabil & Res Ctr, Hammel

Ekstern person

Bolin Thomas

Ekstern person

Mikael Knudsen

Ekstern person

Søren K. Christensen

  • Bang & Olufsen A/S

Ekstern person

Pekka Kyösti

  • Anite Telecoms Oy

Ekstern person

Suiyan Geng

Ekstern person

M. Sørensen

Ekstern person

Maciej Klemm

  • Univ Bristol

Ekstern person

Gerhard Kristensson

  • Lund University

Ekstern person

Yuxiang Zhang

  • Beijing University of Posts and Telecommunications

Ekstern person

Boris Manev

  • Vrije Universiteit Amsterdam

Ekstern person

J Shin

  • WiSpry

Ekstern person

Søren K Kjaergaard

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C

Ekstern person

Bjarne Klemmensen

Ekstern person

Wonbin Hong

  • Pohang University of Science and Technology

Ekstern person

Dario Farina

Ekstern person

Robert Zachariae

  • Aarhus University Hospital

Ekstern person

Changbin Xue

  • CAS - National Space Science Center

Ekstern person

Boyan Yanakiev

  • Molex Antenna Business Unit

Ekstern person

Persefoni Kyritsi

  • European Patent Office

Ekstern person

Yingsong Li

  • Harbin Engineering University

Ekstern person

Minggui Ai

Ekstern person

G Troster

Ekstern person

Marcos Daniel Katz

  • Samsung

Ekstern person

Lars Bo Hansen

  • LM Wind Power

Ekstern person

E H Sørensen

Ekstern person

Xavier Carreño

  • Intel

Ekstern person

Xiaoming Chen

  • Zhejiang University
  • Xi'an Jiaotong University

Ekstern person

W Wang

Ekstern person

Yonghui Huang

Ekstern person

L. J. Foged

  • SATIMO, Pomezia

Ekstern person

Svante Widell

Ekstern person

J. O. Nielsen

Ekstern person

Tobias Holmgaard

  • Mekoprint A/S

Ekstern person

Bo Ai

  • Peng Cheng Laboratory
  • Zhengzhou University

Ekstern person

Michael Buehrer

Ekstern person

Torben Sigsgård

  • Aarhus University

Ekstern person

Miia Nurkkala

  • Nokia

Ekstern person

Guangsheng Deng

  • Hefei University of Technology

Ekstern person

Yusheng Zhang

  • Beihang University

Ekstern person

Morten Christensen

  • Motorola

Ekstern person

Bundgaard Peter

  • Infineon Technologies AG

Ekstern person

Yang Miao

Ekstern person

Chengxiang Wang

  • Heriot-Watt University

Ekstern person

Zoran Blazevic

  • University of Split

Ekstern person

Knud A. Baltsen

  • Bang & Olufsen A/S

Ekstern person

Markus Herdin

  • Rohde&Schwarz

Ekstern person

Matti Latva-aho

  • University of Oulu

Ekstern person

Yun Chen

Ekstern person

Maja Stella

  • University of Split

Ekstern person

A. Yamamoto

  • Panasonic

Ekstern person

Jagjit Jagjit

  • Intel

Ekstern person

Yong Fan

  • University of Electronic Science and Technology of China
  • University of Copenhagen

Ekstern person

Cyril Luxey

  • LEAT-CNRS, University of Nice-Sophia Antipolis

Ekstern person

S.A. Larsson

Ekstern person

Xuefeng Yin

Ekstern person

Dajana Cassioli

Ekstern person

I Dioum

  • Département Génie Informatique, Ecole Supérieure Polytechnique, Université Cheikh Anta Diop de Dakar

Ekstern person

Zuleita Ho

  • Sony Group Corporation

Ekstern person

Kun Li

Ekstern person

Ingunn S. Riddervold

  • Aarhus University
  • Prehospital Emergency Medical Services

Ekstern person

A. Gjedde

Ekstern person

Xingfeng Wu

Ekstern person

Soon L. Ling

  • Vodafone Group Services Limited, Newbury

Ekstern person

Felice Francesco Tafuri

Ekstern person

Shitao Zhu

Ekstern person

Peng Wang

Ekstern person

Werner L. Schroeder

Ekstern person

P. Raskmark

Ekstern person

Kai Mao

  • Nanjing University of Aeronautics and Astronautics
  • University of Twente

Ekstern person

C Bailey

Ekstern person

Li Tian

Ekstern person

Victor Steel

  • WiSpry

Ekstern person

S Denno

Ekstern person

Andreas Molish

Ekstern person

Zeeshan Nazneen

Ekstern person

M Klemm

Ekstern person

Thomas Kürner

  • IfN, Braunschweig Technical University

Ekstern person

Boris Manev

  • Bellona

Ekstern person

Wei Wang

  • Beijing Jiaotong University

Ekstern person

Ya Jing

Ekstern person

C. Kloch

Ekstern person

Jianying Li

  • Northwestern Polytechnical University Xian

Ekstern person

Theodoros Samaras

  • University of Thessaloniki

Ekstern person

Ying Zhang

Ekstern person

E. H. Sørensen

Ekstern person

G. Liang

Ekstern person

Do-Young Kim

  • Samsung Electronics, Co. Ltd.

Ekstern person

Mikael Bergholz Knudsen

  • Infineon Technologies

Ekstern person

Kin Lien Chee

  • Technical University of Braunschweig

Ekstern person

Jan Welinder

  • SP Technical Research Institute of Sweden

Ekstern person

Thomas Kurner

  • Technical University of Braunschweig

Ekstern person

Markku Hintsala

  • Oy

Ekstern person

Anatoliy IOFFE

Ekstern person

J.O. Nielsen

Ekstern person

Ingunn Skogstad Riddervold

  • Univ Aarhus, Sch Publ Hlth, Dept Environm & Occupat Med, DK-8000 Aarhus C
  • Aarhus University

Ekstern person

Kjell Hansson Mild

  • Umeå University

Ekstern person

Gerhard Bauch

  • DoCoMo Euro-Labs

Ekstern person

Wei Min Wang

  • Beijing University of Posts and Telecommunications
  • Shandong University

Ekstern person

Michael Foegelle

Ekstern person

Iyappan Ramachandran

Ekstern person

Christoph Gagern

Ekstern person

Arne Møller

  • Aarhus University
  • Sino-Danish Center for Education and Research
  • Aarhus University Hospital

Ekstern person

D. Gerhardt

  • GomSpace A/S

Ekstern person

Xavier Carreño

  • Intel

Ekstern person

Christophe Solis

Ekstern person

Cheng-Xiang Wang

  • Southeast University, Nanjing
  • Purple Mountain Laboratories, Nanjing

Ekstern person

A Møller

Ekstern person

Morten Christensen

  • Mekoprint A/S

Ekstern person

Jianxing Li

Ekstern person

E. H. Despointes

Ekstern person

Alexandru Tatomirescu

  • Department of Telecommunications
  • Politehnica University of Bucharest

Ekstern person

Tim Brown

  • University of Surrey, Guildford

Ekstern person

Yu-Xiang Sun

  • The College of Electronics and Information Engineering

Ekstern person

Heng Wang

Ekstern person

A. Ioffe

Ekstern person

Per H. Lehne

Ekstern person

Keong Kam

  • EMC Laboratory, Missouri University of Science and Technology

Ekstern person

Mikael B. Knudsen

  • Intel

Ekstern person

E. Kuehne

  • Danfoss AS

Ekstern person

Young-Kwon Cho

  • Samsung Electronics CO., LTD
  • Samsung

Ekstern person

B. Vejlgaard

Ekstern person

Philippe De Doncker

  • Univ Libre, Brussels

Ekstern person

Wen Yang

Ekstern person

Heng Wang

  • Beijing Key Laboratory of Work Safety Intelligent Monitoring
  • Beijing University of Posts and Telecommunications

Ekstern person

M.B. Knudsen

Ekstern person

Francescantonio Della Rosa

  • Tampere University

Ekstern person

Yingzheng Yin

  • Xidian University

Ekstern person

Xiang Zhang

Ekstern person

Povl Raskmark

Ekstern person

Doug Reed

Ekstern person

Fredrik Tufvesson

  • Lund University

Ekstern person

Xingfeng Wu

  • Huawei Technologies Co., Ltd.

Ekstern person

J. Estrada

  • Satimo, Kennesaw

Ekstern person

Stefan Schwarz

Ekstern person

B.N. Vejlgaard

Ekstern person

MB Knudsen

Ekstern person

Chan-Byoung Chae

Ekstern person

J. Takada

  • Graduate School of Science and Engineering, Tokyo Institute of Technology

Ekstern person

H. Suda

Ekstern person

Yun Chen

Ekstern person

M. Jeppesen

Ekstern person

Mikael B. Knudsen

  • Infineon Technologies, Denmark A/S

Ekstern person

Torsten Østervall

Ekstern person

Y. Liu

Ekstern person

Sven Kuhn

  • Schmid & Partner Engineering AG

Ekstern person

Morten Christensen

  • Molex

Ekstern person

Jeffrey L Wilson

Ekstern person

Raed A. Abd-Alhameed

  • University of Bradford

Ekstern person

Guenter Krenz

Ekstern person

ZHENGPENG WANG

  • Beihang University

Ekstern person

Anders D. Pedersen

  • Hammel Research Center

Ekstern person

J. Graffin

Ekstern person

Tyler Brown

Ekstern person

Martin Jacob

  • Technische Universitet Braunschweig

Ekstern person

Luc Martens

  • Ghent University

Ekstern person

Maozhong Song

  • Nanjing University of Aeronautics and Astronautics

Ekstern person

I Z Kovcs

Ekstern person

Jukka-Pekka Nuutinen

Ekstern person

Kun Zhao

  • KTH Royal Institute of Technology

Ekstern person

Lars Mølhave

  • Aarhus University

Ekstern person

Yang Hao

  • Queen Mary Col/Univ London

Ekstern person

Andriy Radchenko

  • EMC Laboratory, Missouri University of Science and Technology

Ekstern person

Andrew Fort

  • Vrije Univ Brussels

Ekstern person

T. Baumgartner

Ekstern person

Bo Xu

  • Zhejiang University
  • KTH Royal Institute of Technology
  • Ericsson AB

Ekstern person

Weimin Wang

Ekstern person

Strahinja Dosen

Ekstern person

Qiuming Zhu

  • Nanjing University of Aeronautics and Astronautics

Ekstern person

Geun-Ho Lee

  • Yonsei University
  • Dankook University

Ekstern person

L. J. Foged

  • SATIMO, Pomezia, Italy & Motorola Mobility Inc., Libertyville

Ekstern person

Knudsen Mikael B.

  • Infineon

Ekstern person

Tan Yi

  • Heriot-Watt University

Ekstern person

T. Hayashi

  • Pansonic

Ekstern person

Yunfeng Li

Ekstern person

Toshiteru Hayashi

  • Communication System Development Center, Panasonic Mobile Communications Co.

Ekstern person

Wim Kotterman

Ekstern person

Cyril Luxey

  • Université de Nice Sophia-Antipolis, LEAT - CNRS UMR

Ekstern person

C. Johansen

Ekstern person

Zhao Xu

  • Huawei Technologies Co., Ltd.

Ekstern person

Michael B. Knudsen

Ekstern person

Morten Christensen

  • Molex Antenna Business Unit

Ekstern person

Maria Fresia

  • Intel

Ekstern person

Xianfeng Liang

Ekstern person

SAMSUNG Electronics CO LTD

  • Samsung

Ekstern person

Gunter Krenz

  • Xtel Aps

Ekstern person

Jürgen Kunish

Ekstern person

Hanpeng Li

Ekstern person

G. Faessler

Ekstern person

M.B, Knudsen

Ekstern person

Mikael Knudsen

  • Intel

Ekstern person

Gholamreza Moradi

  • Amirkabir University of Technology

Ekstern person

Sung-Kwong Hong

Ekstern person

I. Szini

Ekstern person

Tsutomu Sakata

  • Panasonic

Ekstern person

Robert Zachariae

  • Aarhus Univ Hosp, Psychooncol Res Unit, DK-8000 Aarhus

Ekstern person

Anxue Zhang

  • Xi'an Jiaotong University

Ekstern person

Guido Dietl

  • DoCoMo Euro-Labs

Ekstern person

Debang Liu

  • Chongqing University

Ekstern person

A. Diallo

  • LEAT-CNRS, University of Nice-Sophia Antipolis

Ekstern person

G Faessler

Ekstern person

Pekka Kyosti

  • University of Oulu
  • Keysight Technologies

Ekstern person