Material Science
Diode
87%
Thermal Cycling
81%
Aluminum
50%
Protective Atmosphere
39%
Devices
33%
Film
31%
Liquid
25%
Temperature
25%
Metal
25%
Microstructural Evolution
20%
Power Electronics
20%
Electron Backscatter Diffraction
18%
X-Ray Diffraction
18%
Electrical Property
18%
Mechanical Stress
16%
Corrosion
14%
Energy-Dispersive X-Ray Spectroscopy
12%
Electronics
12%
Semiconductor Material
12%
Ultimate Tensile Strength
12%
High Power Electronics
12%
Surface Roughness
12%
Void Growth
6%
Mechanical Strength
6%
Shear Testing
6%
Microscopy
6%
Intermetallics
6%
Crack Formation
6%
Shear Strength
6%
Grain Size
6%
Scanning Electron Microscopy
6%
Microstructure
6%
Characterization
6%
Oxidation Reaction
6%
Aluminum Oxide
6%
Engineering
Metallizations
100%
Transients
50%
Interconnects
50%
Low-Temperature
50%
Mechanisms
43%
Baseplate
25%
Comparative Study
25%
Substrates
25%
Antenna
25%
Texture Evolution
25%
Wavelength
12%
Promising Candidate
11%
Intermetallics
11%
Energy Engineering
10%
Corrosion
9%
Ray Diffraction
9%
Characteristics
9%
Failure (Mechanical)
8%
Degradation Process
8%
Experiments
7%
Demonstrates
6%
Crack Formation
6%
Terahertz
6%
Flat Substrate
6%
Radiation
6%
Dielectrics
6%
Test Setup
6%
Current Load
6%
Bond Strength
6%
Optical Testing
6%
Power Electronics
5%
Energy-Dispersive X-Ray Analysis
5%
Power Electronic Device
5%
Thermal Performance
5%
Small Number
5%
Coefficient of Expansion
5%
Subgrain Formation
5%
Density
5%
Compressive Stress
5%
Tensile Stress σ
5%
Simple Model
5%
Semiconductor
5%
Significant Increase
5%
Individual Grain
5%
Layer Structure
5%
Earth and Planetary Sciences
Planetary Atmosphere
25%
Experiment
8%
Microprocessor
8%
Scanning Electron Microscopy
8%
Grain Size
8%
X Ray Diffraction
8%
Relative Humidity
8%
Cycle
8%
Electron
8%
Show
8%
Chips (Electronics)
8%
Investigation
8%
Size Distribution
8%
Diffraction
8%
X Ray Spectroscopy
8%
Tendency
8%
