APEC 2023 Outstanding poster award

Relateret indhold

• Projekter

• Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module

  Projekter: Projekt › Ph.d.-projekt

• Center of Digitalized Electronics (CoDE)

  Projekter: Projekt › Forskning

• Publikationer

• Reliability design of 10 kV SiC-MOSFET power modules based on thermo-mechanical simulations

  Publikation: Ph.d.-afhandling

• Heat cycle failure point prediction by 3D thermal stress analysis for medium voltage power module

  Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review