IEEE SPEC 2018 Best Paper Award

Pris: Konferencepriser

Beskrivelse

Best Paper Award to Mengxing Chen, Huai Wang, Frede Blaabjerg, Xiongfei Wang and Donghua Pan for the paper entitled "A Temperature-dependent Thermal Model of Silicon Carbide MOSFET Module for Long-term Reliability Assessment". This Prize was awarded by Jason Lai
Tildelingsdatodec. 2018
Grad af anerkendelseInternational
Tildelende organisationerIEEE

Tildelt ved begivenhed

BegivenhedstitelThe 4th IEEE Southern Power Electronics Conference, SPEC 2018
StedNanyang Technological University, , SingaporeVis på kort
Periode10 dec. 2018 → 13 dec. 2018

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