With the development of wide band gap (WBG) semiconductor materials and packaging technology, various more compact and efficient electronic systems have been designed and manufactured. However, the actual application of novel packaging can only be achieved when sufficient reliability is guaranteed. The change of the packaging structure will inevitably change its reliability level, which is reflected in the thermomechanical problems caused by the assembly process steps and material properties such as differences in coefficient of thermal expansion. The research on reliability of new packaging schemes using wide band gap semiconductors should comprehensively consider various potential failure modes, and form a widely applicable reliability analysis process. Due to frequent design optimizations and updates of packaging schemes, the traditional reliability tests based on physical prototype manufacturing is expensive and time-consuming. The digital design method is an effective tool to solve this problem. In order to evaluate the packaging reliability level of WBG semiconductors adequately, it is necessary to fundamentally understand the physical causes of packaging failure. Therefore, the reliability simulation analysis method based on physics of failure (PoF) will be used in this research. In order to verify the robustness of this research method, tests will be designed to verify the simulation results.The goal of this subject is to establish a packaging reliability analysis method based on digital design methods and PoF theory, and to promote the optimization and reliable application of WBG semiconductors.

Funding: China Scholarship Council
Effektiv start/slut dato01/12/202130/11/2024


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