A Busbar Integrated SiC-based Converter with Embedded Heat-pipes

Yao Chang, Amir Sajjad Bahman, Haoze Luo, Wuhua Li, Xiangning He, Francesco Iannuzzo, Frede Blaabjerg

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

1 Citationer (Scopus)

Abstrakt

In this paper, a bus-bar integrated packaging technology for press-pack power modules is proposed. The proposed packaging technology features high power-density, even pressure distribution among chips, and low stray parameters. The structure design and fabrication flow process are analyzed and experiments are made to verify the feasibility of proposed solution. The critical challenge about the package is related to thermal management. To reduce the thermal stress of chips, a heat-pipe integrated heatsink is developed and finite-element-method (FEM) simulations are used to evaluate the cooling performance of the proposed heatsink. The results demonstrate that the proposed heatsink has a relatively low cost and works effectively. It paves the way to better packaging design and more efficient thermal management method for high power devices.
OriginalsprogEngelsk
TitelProceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)
Antal sider7
ForlagIEEE Press
Publikationsdatomaj 2019
Sider2166-2172
Artikelnummer8796953
ISBN (Elektronisk)9788957083130
StatusUdgivet - maj 2019
Begivenhed10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia - Busan, Sydkorea
Varighed: 27 maj 201930 maj 2019

Konference

Konference10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia
LandSydkorea
ByBusan
Periode27/05/201930/05/2019
NavnInternational Conference on Power Electronics
ISSN2150-6078

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