In this paper, a bus-bar integrated packaging technology for press-pack power modules is proposed. The proposed packaging technology features high power-density, even pressure distribution among chips, and low stray parameters. The structure design and fabrication flow process are analyzed and experiments are made to verify the feasibility of proposed solution. The critical challenge about the package is related to thermal management. To reduce the thermal stress of chips, a heat-pipe integrated heatsink is developed and finite-element-method (FEM) simulations are used to evaluate the cooling performance of the proposed heatsink. The results demonstrate that the proposed heatsink has a relatively low cost and works effectively. It paves the way to better packaging design and more efficient thermal management method for high power devices.
|Konference||10th International Conference on Power Electronics - ECCE Asia, ICPE 2019 - ECCE Asia|
|Periode||27/05/2019 → 30/05/2019|
|Navn||International Conference on Power Electronics|