A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules

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Resumé

Detailed thermal dynamics of high power IGBT modules are important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behavior in the IGBTs: The typically used thermal model based on one-dimensional RC lumps have limits to provide temperature distributions inside the device, moreover some variable factors in the real-field applications like the cooling and heating conditions of the converter cannot be adapted. On the other hand, the more advanced three-dimensional thermal models based on Finite Element Method (FEM) need massive computations, which make the long-term thermal dynamics difficult to calculate. In this paper, a new lumped three-dimensional thermal model is proposed, which can be easily characterized from FEM simulations and can acquire the critical thermal distribution under long-term studies. Meanwhile the boundary conditions for the thermal analysis are modeled and included, which can be adapted to different real-field applications of power electronic converters. Finally, the accuracy of the proposed thermal model is verified by FEM simulations and experimental results show a good agreement.
OriginalsprogEngelsk
TidsskriftI E E E Transactions on Power Electronics
Vol/bind33
Udgave nummer3
Sider (fra-til)2518 - 2530
Antal sider13
ISSN0885-8993
DOI
StatusUdgivet - mar. 2018

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Insulated gate bipolar transistors (IGBT)
Boundary conditions
Power electronics
Finite element method
Hot Temperature
Reliability analysis
Thermoanalysis
Temperature distribution
Cooling
Heating

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title = "A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules",
abstract = "Detailed thermal dynamics of high power IGBT modules are important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behavior in the IGBTs: The typically used thermal model based on one-dimensional RC lumps have limits to provide temperature distributions inside the device, moreover some variable factors in the real-field applications like the cooling and heating conditions of the converter cannot be adapted. On the other hand, the more advanced three-dimensional thermal models based on Finite Element Method (FEM) need massive computations, which make the long-term thermal dynamics difficult to calculate. In this paper, a new lumped three-dimensional thermal model is proposed, which can be easily characterized from FEM simulations and can acquire the critical thermal distribution under long-term studies. Meanwhile the boundary conditions for the thermal analysis are modeled and included, which can be adapted to different real-field applications of power electronic converters. Finally, the accuracy of the proposed thermal model is verified by FEM simulations and experimental results show a good agreement.",
keywords = "Boundary conditions, Finite-element method (FEM), Insulated gate bipolar transistors (IGBTs), Power converters, Reliability, Thermal modeling",
author = "Bahman, {Amir Sajjad} and Ke Ma and Frede Blaabjerg",
year = "2018",
month = "3",
doi = "10.1109/TPEL.2017.2694548",
language = "English",
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A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules. / Bahman, Amir Sajjad; Ma, Ke; Blaabjerg, Frede.

I: I E E E Transactions on Power Electronics, Bind 33, Nr. 3, 03.2018, s. 2518 - 2530.

Publikation: Bidrag til tidsskriftTidsskriftartikelForskningpeer review

TY - JOUR

T1 - A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High Power IGBT Modules

AU - Bahman, Amir Sajjad

AU - Ma, Ke

AU - Blaabjerg, Frede

PY - 2018/3

Y1 - 2018/3

N2 - Detailed thermal dynamics of high power IGBT modules are important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behavior in the IGBTs: The typically used thermal model based on one-dimensional RC lumps have limits to provide temperature distributions inside the device, moreover some variable factors in the real-field applications like the cooling and heating conditions of the converter cannot be adapted. On the other hand, the more advanced three-dimensional thermal models based on Finite Element Method (FEM) need massive computations, which make the long-term thermal dynamics difficult to calculate. In this paper, a new lumped three-dimensional thermal model is proposed, which can be easily characterized from FEM simulations and can acquire the critical thermal distribution under long-term studies. Meanwhile the boundary conditions for the thermal analysis are modeled and included, which can be adapted to different real-field applications of power electronic converters. Finally, the accuracy of the proposed thermal model is verified by FEM simulations and experimental results show a good agreement.

AB - Detailed thermal dynamics of high power IGBT modules are important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behavior in the IGBTs: The typically used thermal model based on one-dimensional RC lumps have limits to provide temperature distributions inside the device, moreover some variable factors in the real-field applications like the cooling and heating conditions of the converter cannot be adapted. On the other hand, the more advanced three-dimensional thermal models based on Finite Element Method (FEM) need massive computations, which make the long-term thermal dynamics difficult to calculate. In this paper, a new lumped three-dimensional thermal model is proposed, which can be easily characterized from FEM simulations and can acquire the critical thermal distribution under long-term studies. Meanwhile the boundary conditions for the thermal analysis are modeled and included, which can be adapted to different real-field applications of power electronic converters. Finally, the accuracy of the proposed thermal model is verified by FEM simulations and experimental results show a good agreement.

KW - Boundary conditions

KW - Finite-element method (FEM)

KW - Insulated gate bipolar transistors (IGBTs)

KW - Power converters

KW - Reliability

KW - Thermal modeling

U2 - 10.1109/TPEL.2017.2694548

DO - 10.1109/TPEL.2017.2694548

M3 - Journal article

VL - 33

SP - 2518

EP - 2530

JO - I E E E Transactions on Power Electronics

JF - I E E E Transactions on Power Electronics

SN - 0885-8993

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