A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Zhongxu Wang; Huai Wang; Yi Zhang; Frede Blaabjerg

doi:10.1109/APEC.2019.8721785

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

Zhongxu Wang, Huai Wang, Yi Zhang, Frede Blaabjerg

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

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Abstract

Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

Originalsprog	Engelsk
Titel	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Antal sider	6
Udgivelsessted	USA
Forlag	IEEE Press
Publikationsdato	24 maj 2019
Sider	313-318
Artikelnummer	8721785
ISBN (Trykt)	978-1-5386-8331-6
ISBN (Elektronisk)	9781538683309
DOI	https://doi.org/10.1109/APEC.2019.8721785
Status	Udgivet - 24 maj 2019
Begivenhed	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, USA Varighed: 17 mar. 2019 → 21 mar. 2019

Konference

Konference	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Land/Område	USA
By	Anaheim
Periode	17/03/2019 → 21/03/2019
Sponsor	IEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)

Navn	IEEE Applied Power Electronics Conference and Exposition (APEC)
ISSN	2470-6647

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10.1109/APEC.2019.8721785

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel ConvertersIndsendt manuskript, 2,14 MB

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1 Afsluttet

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning

1 Ph.d.-afhandling

Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters
Wang, Z., 2019, Aalborg Universitetsforlag. 111 s.
Publikation: Ph.d.-afhandling

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Citationsformater

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title = "A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters",

abstract = "Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.",

author = "Zhongxu Wang and Huai Wang and Yi Zhang and Frede Blaabjerg",

year = "2019",

month = may,

day = "24",

doi = "10.1109/APEC.2019.8721785",

language = "English",

isbn = "978-1-5386-8331-6",

series = "IEEE Applied Power Electronics Conference and Exposition (APEC)",

publisher = "IEEE Press",

pages = "313--318",

booktitle = "34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019",

note = "34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 ; Conference date: 17-03-2019 Through 21-03-2019",

}

Wang, Z, Wang, H , Zhang, Y & Blaabjerg, F 2019, A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters. i 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019., 8721785, IEEE Press, USA, IEEE Applied Power Electronics Conference and Exposition (APEC), s. 313-318, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019, Anaheim, USA, 17/03/2019. https://doi.org/10.1109/APEC.2019.8721785

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters. / Wang, Zhongxu; Wang, Huai ; Zhang, Yi et al.
34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. USA: IEEE Press, 2019. s. 313-318 8721785 (IEEE Applied Power Electronics Conference and Exposition (APEC)).

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

TY - GEN

T1 - A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

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AU - Wang, Huai

AU - Zhang, Yi

AU - Blaabjerg, Frede

PY - 2019/5/24

Y1 - 2019/5/24

N2 - Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

AB - Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

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U2 - 10.1109/APEC.2019.8721785

DO - 10.1109/APEC.2019.8721785

M3 - Article in proceeding

SN - 978-1-5386-8331-6

T3 - IEEE Applied Power Electronics Conference and Exposition (APEC)

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EP - 318

BT - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

PB - IEEE Press

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T2 - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

Y2 - 17 March 2019 through 21 March 2019

ER -

A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

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Center Of Reliable Power Electronics (CORPE)

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Mission Profile Based Control and Reliability Improvement Strategies of Modular Multilevel Converters

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