A Minimum Viable Mission Profile Emulator for IGBT Modules in Modular Multilevel Converters

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Abstrakt

Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

OriginalsprogEngelsk
Titel34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Antal sider6
UdgivelsesstedUSA
ForlagIEEE Press
Publikationsdato24 maj 2019
Sider313-318
Artikelnummer8721785
ISBN (Trykt)978-1-5386-8331-6
ISBN (Elektronisk)9781538683309
DOI
StatusUdgivet - 24 maj 2019
Begivenhed34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, USA
Varighed: 17 mar. 201921 mar. 2019

Konference

Konference34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
LandUSA
ByAnaheim
Periode17/03/201921/03/2019
SponsorIEEE Industry Applications Society (IAS), IEEE Power Electronics Society (PELS), Power Sources Manufacturers Association (PSMA)
NavnIEEE Applied Power Electronics Conference and Exposition (APEC)
ISSN2470-6647

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