A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions

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Resumé

Thermal management of power electronic devices is essential for reliable performance especially at high power levels. One of the most important activities in the thermal management and reliability improvement is acquiring the temperature information in critical points of the power module. However accurate temperature estimation either vertically or horizontally inside the power devices is still hard to identify. This paper investigates the thermal behavior of high power module in various operating conditions by means of Finite Element Method (FEM). A novel 3D thermal impedance network considering the multi-layer thermal coupling among chips is proposed. The impacts to the thermal impedance by various cooling and heating conditions are also studied. It is concluded that the heating and cooling conditions will have influence on the junction to case thermal impedances and need to be carefully considered in the thermal modelling. The proposed 3D thermal impedance network and the extraction procedure are verified in a circuit simulator and shows to be much faster with the same accuracy compared to FEM simulation. This network can be used for life-time estimation of IGBT module considering the whole converter system and more realistic loading conditions of the device.
OriginalsprogEngelsk
TitelProceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC)
Antal sider7
ForlagIEEE Press
Publikationsdatomar. 2015
Sider1209-1215
ISBN (Trykt)978-1-4799-6735-3
DOI
StatusUdgivet - mar. 2015
Begivenhed30th Annual IEEE Applied Power Electronics Conference and Exposition - Charlotte, USA
Varighed: 15 mar. 201519 mar. 2015

Konference

Konference30th Annual IEEE Applied Power Electronics Conference and Exposition
LandUSA
ByCharlotte
Periode15/03/201519/03/2015
NavnI E E E Applied Power Electronics Conference and Exposition. Conference Proceedings
ISSN1048-2334

Fingerprint

Cooling
Heating
Finite element method
Insulated gate bipolar transistors (IGBT)
Hot Temperature
Power electronics
Temperature control
Simulators
Temperature
Networks (circuits)

Citer dette

Bahman, A. S., Ma, K., & Blaabjerg, F. (2015). A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions. I Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC) (s. 1209-1215). IEEE Press. I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings https://doi.org/10.1109/APEC.2015.7104501
Bahman, Amir Sajjad ; Ma, Ke ; Blaabjerg, Frede. / A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions. Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, 2015. s. 1209-1215 (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).
@inproceedings{3428465428ef4f079aed54e62dc04197,
title = "A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions",
abstract = "Thermal management of power electronic devices is essential for reliable performance especially at high power levels. One of the most important activities in the thermal management and reliability improvement is acquiring the temperature information in critical points of the power module. However accurate temperature estimation either vertically or horizontally inside the power devices is still hard to identify. This paper investigates the thermal behavior of high power module in various operating conditions by means of Finite Element Method (FEM). A novel 3D thermal impedance network considering the multi-layer thermal coupling among chips is proposed. The impacts to the thermal impedance by various cooling and heating conditions are also studied. It is concluded that the heating and cooling conditions will have influence on the junction to case thermal impedances and need to be carefully considered in the thermal modelling. The proposed 3D thermal impedance network and the extraction procedure are verified in a circuit simulator and shows to be much faster with the same accuracy compared to FEM simulation. This network can be used for life-time estimation of IGBT module considering the whole converter system and more realistic loading conditions of the device.",
keywords = "Thermal impedance, Finite element method, Thermal coupling, Heating/cooling conditions, Reliability",
author = "Bahman, {Amir Sajjad} and Ke Ma and Frede Blaabjerg",
year = "2015",
month = "3",
doi = "10.1109/APEC.2015.7104501",
language = "English",
isbn = "978-1-4799-6735-3",
pages = "1209--1215",
booktitle = "Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC)",
publisher = "IEEE Press",

}

Bahman, AS, Ma, K & Blaabjerg, F 2015, A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions. i Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings, s. 1209-1215, 30th Annual IEEE Applied Power Electronics Conference and Exposition, Charlotte, USA, 15/03/2015. https://doi.org/10.1109/APEC.2015.7104501

A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions. / Bahman, Amir Sajjad; Ma, Ke; Blaabjerg, Frede.

Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press, 2015. s. 1209-1215 (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

TY - GEN

T1 - A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions

AU - Bahman, Amir Sajjad

AU - Ma, Ke

AU - Blaabjerg, Frede

PY - 2015/3

Y1 - 2015/3

N2 - Thermal management of power electronic devices is essential for reliable performance especially at high power levels. One of the most important activities in the thermal management and reliability improvement is acquiring the temperature information in critical points of the power module. However accurate temperature estimation either vertically or horizontally inside the power devices is still hard to identify. This paper investigates the thermal behavior of high power module in various operating conditions by means of Finite Element Method (FEM). A novel 3D thermal impedance network considering the multi-layer thermal coupling among chips is proposed. The impacts to the thermal impedance by various cooling and heating conditions are also studied. It is concluded that the heating and cooling conditions will have influence on the junction to case thermal impedances and need to be carefully considered in the thermal modelling. The proposed 3D thermal impedance network and the extraction procedure are verified in a circuit simulator and shows to be much faster with the same accuracy compared to FEM simulation. This network can be used for life-time estimation of IGBT module considering the whole converter system and more realistic loading conditions of the device.

AB - Thermal management of power electronic devices is essential for reliable performance especially at high power levels. One of the most important activities in the thermal management and reliability improvement is acquiring the temperature information in critical points of the power module. However accurate temperature estimation either vertically or horizontally inside the power devices is still hard to identify. This paper investigates the thermal behavior of high power module in various operating conditions by means of Finite Element Method (FEM). A novel 3D thermal impedance network considering the multi-layer thermal coupling among chips is proposed. The impacts to the thermal impedance by various cooling and heating conditions are also studied. It is concluded that the heating and cooling conditions will have influence on the junction to case thermal impedances and need to be carefully considered in the thermal modelling. The proposed 3D thermal impedance network and the extraction procedure are verified in a circuit simulator and shows to be much faster with the same accuracy compared to FEM simulation. This network can be used for life-time estimation of IGBT module considering the whole converter system and more realistic loading conditions of the device.

KW - Thermal impedance

KW - Finite element method

KW - Thermal coupling

KW - Heating/cooling conditions

KW - Reliability

U2 - 10.1109/APEC.2015.7104501

DO - 10.1109/APEC.2015.7104501

M3 - Article in proceeding

SN - 978-1-4799-6735-3

SP - 1209

EP - 1215

BT - Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC)

PB - IEEE Press

ER -

Bahman AS, Ma K, Blaabjerg F. A Novel 3D Thermal Impedance Model for High Power Modules Considering Multi-layer Thermal Coupling and Different Heating/Cooling Conditions. I Proceedings of the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE Press. 2015. s. 1209-1215. (I E E E Applied Power Electronics Conference and Exposition. Conference Proceedings). https://doi.org/10.1109/APEC.2015.7104501