Abstract
The present invention concerns a planar winding assembly for power applications, said assembly comprising a frame accommodating a stack of a plurality of printed circuit boards (PCBs), each comprising at least one conductive winding on the PCB, wherein the stack comprises an uppermost first PCB comprising an electrically insulating layer having a top surface and a bottom surface, where the bottom surface is provided with a conductive winding having a first winding pattern; at least one second PCB comprising an electrically insulating layer having a top surface and a bottom surface with conductive windings thereon, where the top surface is provided with the first winding pattern and the bottom surface is provided with a second winding pattern corresponding to the first winding pattern; a lowermost first PCB, which is similar to the uppermost first PCB but positioned with the winding facing upwards; means for holding the plurality of PCBs tightly against each other in the stacked configuration, and the frame encompasses the stack of PCBs. The invention further concerns a method of manufacturing a planar winding assembly for high-power applications.
| Originalsprog | Engelsk |
|---|---|
| IPC | H01F 17/00 2006.1,H01F 27/28 2006.1,H01F 17/04 2006.1,H01F 27/30 2006.1 |
| Journaliseringsdato | 05/12/2023 |
| Land/Område | Danmark |
| Prioritetsdato | 05/12/2022 |
| Prioritetsnummer | PA202270581 |
| Status | Udgivet - 2024 |