Accelerated Voltage Endurance Test and Insulation Lifetime Estimation of Silicone-Gel Encapsulated Direct-Bond-Copper Substrates for Medium-Voltage Power Module Packaging

Yuan Gao, Zichen Zhang, Zachary Zintak, Emmanuel Arriola, Thore Stig Aunsborg, Stig Munk-Nielsen, Guo-Quan Lu

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

Abstract

The advent of medium-voltage silicon carbide devices presents the potential to significantly improve the efficiency and simplicity of power electronics for grid-tied applications. However, the frequent occurrence of insulation failure in me-dium-voltage power modules undermines their reliability and hampers their widespread adoption. There is a lack of research on the insulation characteristics of the module under long-term high voltage stresses. In this work, an accelerated voltage endurance test was conducted on alumina direct-bond copper substrates encapsulated in a silicone gel to establish an insulation lifetime model for medium-voltage power modules. Based on the test data and the model, to achieve an insulation life exceeding one year for the substrate under a constant voltage stress, the maximum operating voltage is recommended to be lower than 49% of its partial discharge inception voltage.
OriginalsprogEngelsk
TitelCIPS 2024; 13th International Conference on Integrated Power Electronics Systems
Antal sider5
Publikationsdato12 mar. 2024
Sider341-345
ISBN (Elektronisk)9783800762880
StatusUdgivet - 12 mar. 2024

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