An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

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12 Citationer (Scopus)
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Abstrakt

Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.
OriginalsprogEngelsk
TitelProceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Antal sider8
ForlagIEEE Press
Publikationsdatosep. 2014
Sider5502-5509
ISBN (Trykt)978-1-4799-5776-7
DOI
StatusUdgivet - sep. 2014
Begivenhed2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, Pittsburgh, USA
Varighed: 14 sep. 201418 sep. 2014

Konference

Konference2014 IEEE Energy Conversion Congress and Exposition (ECCE)
LokationPittsburgh
Land/OmrådeUSA
ByPittsburgh
Periode14/09/201418/09/2014

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