Projekter pr. år
Abstract
Bond wires fatigue is one of the dominant failure mechanisms of IGBT modules. Prior-art research mainly focuses on its impact on the end-of-life failure, while its effect on the short-circuit capability of IGBT modules is still an open issue. This paper proposes a new electro-thermal simulation approach enabling analyze the impact of the bond wires fatigue on the current and temperature distribution on IGBT chip surface under short-circuit. It is based on an Icepack-PSpice co-simulation by taking the advantage of both a finite element thermal model and an advanced PSpice-based multi-cell IGBT model. A study case on a 1700 V/1000 A IGBT module demonstrates the effectiveness of the proposed simulation method.
Originalsprog | Engelsk |
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Titel | Proceedings of the 2014 IEEE Energy Conversion Congress and Exposition (ECCE) |
Antal sider | 8 |
Forlag | IEEE Press |
Publikationsdato | sep. 2014 |
Sider | 5502-5509 |
ISBN (Trykt) | 978-1-4799-5776-7 |
DOI | |
Status | Udgivet - sep. 2014 |
Begivenhed | 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, Pittsburgh, USA Varighed: 14 sep. 2014 → 18 sep. 2014 |
Konference
Konference | 2014 IEEE Energy Conversion Congress and Exposition (ECCE) |
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Lokation | Pittsburgh |
Land/Område | USA |
By | Pittsburgh |
Periode | 14/09/2014 → 18/09/2014 |
Fingeraftryk
Dyk ned i forskningsemnerne om 'An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit'. Sammen danner de et unikt fingeraftryk.Projekter
- 1 Afsluttet
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Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning
Aktiviteter
- 1 Konferenceoplæg
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2014 IEEE Energy Conversion Congress and Exposition (ECCE)
Huai Wang (Oplægsholder)
14 sep. 2014 → 19 sep. 2014Aktivitet: Foredrag og mundtlige bidrag › Konferenceoplæg