An Icepak-PSpice Co-Simulation Method to Study the Impact of Bond Wires Fatigue on the Current and Temperature Distribution of IGBT Modules under Short-Circuit

Rui Wu, Francesco Iannuzzo, Huai Wang, Frede Blaabjerg

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

15 Citationer (Scopus)
754 Downloads (Pure)
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