7 Citationer (Scopus)

Abstract

We present a framework to analyse the latency budget in wireless systems with Mobile Edge Computing (MEC). Our focus is on teleoperation and telerobotics, as use cases that are representative of mission-critical uplink-intensive IoT systems with requirements on low latency and high reliability. The study is motivated by a general question: What is the optimal compression strategy in reliability and latency constrained systems? We address this question by studying the latency of an uplink connection from a multi-sensor IoT device to the base station. This is a critical link tasked with a timely and reliable transfer of potentially significant amount of data from the multitude of sensors. We introduce a comprehensive model for the latency budget, incorporating data compression and data transmission. The uplink latency is a random variable whose distribution depends on the computational capabilities of the device and on the properties of the wireless link. We formulate two optimization problems corresponding to two transmission strategies: (1) Outage-constrained, and (2) Latency-constrained. We derive the optimal system parameters under a reliability criterion. We show that the obtained results are superior compared to the ones based on the optimization of the expected latency.

OriginalsprogEngelsk
TitelICC 2022 - IEEE International Conference on Communications
Antal sider6
ForlagIEEE (Institute of Electrical and Electronics Engineers)
Publikationsdato2022
Sider5029-5034
ISBN (Trykt)978-1-5386-8348-4
ISBN (Elektronisk)978-1-5386-8347-7
DOI
StatusUdgivet - 2022
Begivenhed2022 IEEE International Conference on Communications, ICC 2022 - Seoul, Sydkorea
Varighed: 16 maj 202220 maj 2022

Konference

Konference2022 IEEE International Conference on Communications, ICC 2022
Land/OmrådeSydkorea
BySeoul
Periode16/05/202220/05/2022
Sponsoret al., Huawei Technologies Co., Ltd., LG, Qualcomm, Samsung, Technology Innovation Institute (TII)
NavnI E E E International Conference on Communications
Vol/bind2022-May
ISSN1550-3607

Bibliografisk note

Publisher Copyright:
© 2022 IEEE.

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