| Originalsprog | Engelsk |
|---|---|
| Publikationsdato | 17 apr. 2023 |
| Antal sider | 4 |
| Status | Under udarbejdelse - 17 apr. 2023 |
Analysis of the Influence of the Bottom-layer Copper in Direct-Bond Copper Substrate on its Overall Electric Field and Partial Discharge Performance
Yuan Gao, Thore Stig Aunsborg, Kai Yin, Claus Leth Bak, Hongbo Zhao, zichen zhang, Stig Munk-Nielsen, Christian Uhrenfeldt
- AAU Energi
- Det Ingeniør- og Naturvidenskabelige Fakultet
- Power Electronics System Integration and Materials
- Electric Power Systems and Microgrids
- Electronic Power Grid
- Power Electronics Packaging, Materials and Emerging Applications
- Modern Power Transmission Grids
- Intelligent Energy Systems and Flexible Markets
- Low Power Energy Harvesting and I-Solutions
Publikation: Konferencebidrag uden forlag/tidsskrift › Paper uden forlag/tidsskrift › Forskning