Common mode current mitigation for medium voltage half bridge SiC modules

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4 Citationer (Scopus)

Resumé

Medium voltage 10 kV Silicon Carbide MOSFETs, introduce challenges regarding converter design. Very high rate of voltage change and capacitive couplings to for example cooling systems cause increased electromagnetic interference. The aim of this paper is to accurately model the capacitive coupling to a heat sink and experimentally validate the model. An analytic model of the heat sink is developed which is demonstrated to be in excellent agreement with experimental results. The experimental result validates the modelled heat sink network allowing engineers to choose a suitable grounding impedance to comply with the electromagnetic compatibility regulations.
OriginalsprogEngelsk
TitelProceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe)
Antal sider8
ForlagIEEE Press
Publikationsdatosep. 2017
ISBN (Elektronisk)978-90-75815-27-6
DOI
StatusUdgivet - sep. 2017
Begivenhed2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe) - Warsaw, Polen
Varighed: 11 sep. 201714 sep. 2017

Konference

Konference2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe)
LandPolen
ByWarsaw
Periode11/09/201714/09/2017

Fingerprint

Heat sinks
Electric potential
Electromagnetic compatibility
Electric grounding
Signal interference
Cooling systems
Silicon carbide
Engineers

Citer dette

Christensen, Nicklas ; Jørgensen, Asger Bjørn ; Dalal, Dipen Narendra ; Sønderskov, Simon Dyhr ; Beczkowski, Szymon ; Uhrenfeldt, Christian ; Munk-Nielsen, Stig. / Common mode current mitigation for medium voltage half bridge SiC modules. Proceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe). IEEE Press, 2017.
@inproceedings{5563237c41d846079e7322326505fd97,
title = "Common mode current mitigation for medium voltage half bridge SiC modules",
abstract = "Medium voltage 10 kV Silicon Carbide MOSFETs, introduce challenges regarding converter design. Very high rate of voltage change and capacitive couplings to for example cooling systems cause increased electromagnetic interference. The aim of this paper is to accurately model the capacitive coupling to a heat sink and experimentally validate the model. An analytic model of the heat sink is developed which is demonstrated to be in excellent agreement with experimental results. The experimental result validates the modelled heat sink network allowing engineers to choose a suitable grounding impedance to comply with the electromagnetic compatibility regulations.",
keywords = "Wide bandgap devices, Silicon Carbide (SiC), EMC/EMI, Noise, New switching devices",
author = "Nicklas Christensen and J{\o}rgensen, {Asger Bj{\o}rn} and Dalal, {Dipen Narendra} and S{\o}nderskov, {Simon Dyhr} and Szymon Beczkowski and Christian Uhrenfeldt and Stig Munk-Nielsen",
year = "2017",
month = "9",
doi = "10.23919/EPE17ECCEEurope.2017.8099202",
language = "English",
booktitle = "Proceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe)",
publisher = "IEEE Press",

}

Christensen, N, Jørgensen, AB, Dalal, DN, Sønderskov, SD, Beczkowski, S, Uhrenfeldt, C & Munk-Nielsen, S 2017, Common mode current mitigation for medium voltage half bridge SiC modules. i Proceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe). IEEE Press, Warsaw, Polen, 11/09/2017. https://doi.org/10.23919/EPE17ECCEEurope.2017.8099202

Common mode current mitigation for medium voltage half bridge SiC modules. / Christensen, Nicklas; Jørgensen, Asger Bjørn; Dalal, Dipen Narendra; Sønderskov, Simon Dyhr; Beczkowski, Szymon; Uhrenfeldt, Christian; Munk-Nielsen, Stig.

Proceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe). IEEE Press, 2017.

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

TY - GEN

T1 - Common mode current mitigation for medium voltage half bridge SiC modules

AU - Christensen, Nicklas

AU - Jørgensen, Asger Bjørn

AU - Dalal, Dipen Narendra

AU - Sønderskov, Simon Dyhr

AU - Beczkowski, Szymon

AU - Uhrenfeldt, Christian

AU - Munk-Nielsen, Stig

PY - 2017/9

Y1 - 2017/9

N2 - Medium voltage 10 kV Silicon Carbide MOSFETs, introduce challenges regarding converter design. Very high rate of voltage change and capacitive couplings to for example cooling systems cause increased electromagnetic interference. The aim of this paper is to accurately model the capacitive coupling to a heat sink and experimentally validate the model. An analytic model of the heat sink is developed which is demonstrated to be in excellent agreement with experimental results. The experimental result validates the modelled heat sink network allowing engineers to choose a suitable grounding impedance to comply with the electromagnetic compatibility regulations.

AB - Medium voltage 10 kV Silicon Carbide MOSFETs, introduce challenges regarding converter design. Very high rate of voltage change and capacitive couplings to for example cooling systems cause increased electromagnetic interference. The aim of this paper is to accurately model the capacitive coupling to a heat sink and experimentally validate the model. An analytic model of the heat sink is developed which is demonstrated to be in excellent agreement with experimental results. The experimental result validates the modelled heat sink network allowing engineers to choose a suitable grounding impedance to comply with the electromagnetic compatibility regulations.

KW - Wide bandgap devices

KW - Silicon Carbide (SiC)

KW - EMC/EMI

KW - Noise

KW - New switching devices

U2 - 10.23919/EPE17ECCEEurope.2017.8099202

DO - 10.23919/EPE17ECCEEurope.2017.8099202

M3 - Article in proceeding

BT - Proceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe)

PB - IEEE Press

ER -

Christensen N, Jørgensen AB, Dalal DN, Sønderskov SD, Beczkowski S, Uhrenfeldt C et al. Common mode current mitigation for medium voltage half bridge SiC modules. I Proceedings of 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe). IEEE Press. 2017 https://doi.org/10.23919/EPE17ECCEEurope.2017.8099202