Comparison of Junction Temperature Measurement Using the TSEP Method and Optical Fiber Method in IGBT Power Modules without Silicone Gel Removal

Kaichen Zhang*, Charles Leduc, Francesco Iannuzzo

*Kontaktforfatter

Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskningpeer review

1 Citationer (Scopus)
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Engineering

Physics

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