Computer-aided engineering simulations

Publikation: Bidrag til bog/antologi/rapport/konference proceedingBidrag til bog/antologiForskningpeer review

4 Downloads (Pure)

Resumé

Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.
OriginalsprogEngelsk
TitelWide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
RedaktørerKatsuaki Suganuma
Antal sider25
ForlagWoodhead Publishing
Publikationsdatojun. 2018
Sider199 - 223
Kapitel8
ISBN (Trykt)978-0-08-102094-4
DOI
StatusUdgivet - jun. 2018
NavnElsevier
ISSN0922-3444

Fingerprint

Computer aided engineering
Energy gap
Industry
Power semiconductor devices

Citer dette

Bahman, A. S., & Iannuzzo, F. (2018). Computer-aided engineering simulations. I K. Suganuma (red.), Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (s. 199 - 223). Woodhead Publishing. Elsevier https://doi.org/10.1016/B978-0-08-102094-4.00010-4
Bahman, Amir Sajjad ; Iannuzzo, Francesco. / Computer-aided engineering simulations. Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. red. / Katsuaki Suganuma. Woodhead Publishing, 2018. s. 199 - 223 (Elsevier).
@inbook{2bcdae6361bb4c039e95de71d986fa6c,
title = "Computer-aided engineering simulations",
abstract = "Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.",
keywords = "Computer-aided engineering, Computer software, Power electronics, Parasitic inductance, Reliability modeling, SiC module, Thermal modeling",
author = "Bahman, {Amir Sajjad} and Francesco Iannuzzo",
year = "2018",
month = "6",
doi = "10.1016/B978-0-08-102094-4.00010-4",
language = "English",
isbn = "978-0-08-102094-4",
pages = "199 -- 223",
editor = "Katsuaki Suganuma",
booktitle = "Wide Bandgap Power Semiconductor Packaging",
publisher = "Woodhead Publishing",

}

Bahman, AS & Iannuzzo, F 2018, Computer-aided engineering simulations. i K Suganuma (red.), Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Woodhead Publishing, Elsevier, s. 199 - 223. https://doi.org/10.1016/B978-0-08-102094-4.00010-4

Computer-aided engineering simulations. / Bahman, Amir Sajjad; Iannuzzo, Francesco.

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. red. / Katsuaki Suganuma. Woodhead Publishing, 2018. s. 199 - 223 (Elsevier).

Publikation: Bidrag til bog/antologi/rapport/konference proceedingBidrag til bog/antologiForskningpeer review

TY - CHAP

T1 - Computer-aided engineering simulations

AU - Bahman, Amir Sajjad

AU - Iannuzzo, Francesco

PY - 2018/6

Y1 - 2018/6

N2 - Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.

AB - Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.

KW - Computer-aided engineering

KW - Computer software

KW - Power electronics

KW - Parasitic inductance

KW - Reliability modeling

KW - SiC module

KW - Thermal modeling

U2 - 10.1016/B978-0-08-102094-4.00010-4

DO - 10.1016/B978-0-08-102094-4.00010-4

M3 - Book chapter

SN - 978-0-08-102094-4

SP - 199

EP - 223

BT - Wide Bandgap Power Semiconductor Packaging

A2 - Suganuma, Katsuaki

PB - Woodhead Publishing

ER -

Bahman AS, Iannuzzo F. Computer-aided engineering simulations. I Suganuma K, red., Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Woodhead Publishing. 2018. s. 199 - 223. (Elsevier). https://doi.org/10.1016/B978-0-08-102094-4.00010-4