Computer-aided engineering simulations

Amir Sajjad Bahman; Francesco Iannuzzo

doi:10.1016/B978-0-08-102094-4.00010-4

Computer-aided engineering simulations

Amir Sajjad Bahman, Francesco Iannuzzo

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Bidrag til bog/antologi › Forskning › peer review

4 Citationer (Scopus)

4 Downloads (Pure)

Abstract

Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.

Originalsprog	Engelsk
Titel	Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Redaktører	Katsuaki Suganuma
Antal sider	25
Forlag	Woodhead Publishing
Publikationsdato	jun. 2018
Sider	199 - 223
Kapitel	8
ISBN (Trykt)	978-0-08-102094-4
DOI	https://doi.org/10.1016/B978-0-08-102094-4.00010-4
Status	Udgivet - jun. 2018

Navn	Elsevier
ISSN	0922-3444

Adgang til dokumentet

10.1016/B978-0-08-102094-4.00010-4

http://www.sciencedirect.com/science/article/pii/B9780081020944000104

AUB Link

Søg efter materialet i Aalborg Universitetsbiblioteks søgemaskine

Center Of Reliable Power Electronics (CORPE)
Blaabjerg, F., Munk-Nielsen, S., Pedersen, K. & Popok, V.
01/04/2011 → 31/12/2016
Projekter: Projekt › Forskning

Citationsformater

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abstract = "Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.",

keywords = "Computer-aided engineering, Computer software, Power electronics, Parasitic inductance, Reliability modeling, SiC module, Thermal modeling",

author = "Bahman, {Amir Sajjad} and Francesco Iannuzzo",

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Computer-aided engineering simulations. / Bahman, Amir Sajjad ; Iannuzzo, Francesco.
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. red. / Katsuaki Suganuma. Woodhead Publishing, 2018. s. 199 - 223 (Elsevier).

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Bidrag til bog/antologi › Forskning › peer review

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AU - Iannuzzo, Francesco

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AB - Computer-aided engineering (CAE) is the use of computer software to simulate the performance of a product in order to improve the design or facilitate solving engineering problems for various industries. The application of software may include simulation, validation, and optimization of products, processes, and manufacturing. In this chapter, application of the CAE in design and analysis of Wide Bandgap power semiconductor devices will be discussed.

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KW - Computer software

KW - Power electronics

KW - Parasitic inductance

KW - Reliability modeling

KW - SiC module

KW - Thermal modeling

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Computer-aided engineering simulations

Abstract

Adgang til dokumentet

AUB Link

Fingeraftryk

Projekter

Center Of Reliable Power Electronics (CORPE)

Citationsformater