TY - GEN
T1 - Converter-level reliability of wind turbine with low sample rate mission profile
AU - Zhou, Dao
AU - Blaabjerg, Frede
PY - 2019/5
Y1 - 2019/5
N2 - The thermal dynamics of power semiconductors and power capacitors are closely related to the reliability and the cost of power electronic converter. However, the component loading in a wind turbine system is disturbed by many factors of the converter system, which is present at various time-constants from microseconds to years. In the case of a mission profile with 1-hour sample rate, the circuit model, loss model, and thermal model of the active power switches and passive capacitors are described and presented. The percentile lifetime of a single component can be predicted according to the long-term electro-thermal profile, and the Weibull function based time-to-failure distribution of the active component and passive component can be obtained. In a 2 MW wind turbine system, it can be seen that the dc-link capacitor bank dominates the converter-level reliability.
AB - The thermal dynamics of power semiconductors and power capacitors are closely related to the reliability and the cost of power electronic converter. However, the component loading in a wind turbine system is disturbed by many factors of the converter system, which is present at various time-constants from microseconds to years. In the case of a mission profile with 1-hour sample rate, the circuit model, loss model, and thermal model of the active power switches and passive capacitors are described and presented. The percentile lifetime of a single component can be predicted according to the long-term electro-thermal profile, and the Weibull function based time-to-failure distribution of the active component and passive component can be obtained. In a 2 MW wind turbine system, it can be seen that the dc-link capacitor bank dominates the converter-level reliability.
UR - http://www.scopus.com/inward/record.url?scp=85071651279&partnerID=8YFLogxK
M3 - Article in proceeding
SN - 978-1-7281-1612-9
T3 - International Conference on Power Electronics
SP - 3309
EP - 3314
BT - Proceedings of 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)
PB - IEEE Press
CY - Korea
T2 - 2019 10th International Conference on Power Electronics and ECCE Asia (ICPE 2019 - ECCE Asia)
Y2 - 27 May 2019 through 30 May 2019
ER -