Cooling of electronic equipment

    Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskning

    Resumé

    Cooling of electronic equipment is studied. The design size of electronic equipment decrease causing the thermal density to increase. This affect the cooling which can cause for example failures of critical components due to overheating or thermal induced stresses. Initially a pin fin heat sink is considered as extruded profiles are inadequate for compact designs. An optimal pin fin shape and configuration is sought also taking manufacturing costs into consideration. Standard methods for geometrical modeling and thermal analysis are applied.
    OriginalsprogEngelsk
    TitelThe 16th Nordic Seminar on Computational Mechanics - Proceedings
    RedaktørerK.M. Mathiesen, T. Kvamsdal, K.M. Okstad
    Forlag<Forlag uden navn>
    Publikationsdato2003
    UdgaveNSCM 16
    Sider155-158
    ISBN (Trykt)8274820665
    StatusUdgivet - 2003
    BegivenhedNordic Seminar on Computational Mechanics - Trondheim, Norge
    Varighed: 16 okt. 200318 okt. 2003
    Konferencens nummer: 16

    Konference

    KonferenceNordic Seminar on Computational Mechanics
    Nummer16
    LandNorge
    ByTrondheim
    Periode16/10/200318/10/2003

    Fingerprint

    Electronic equipment
    Cooling
    Heat sinks
    Thermoanalysis
    Costs
    Hot Temperature

    Emneord

    • computational mechanics
    • FEA
    • FEM

    Citer dette

    A. Kristensen, A. S. (2003). Cooling of electronic equipment. I K. M. Mathiesen, T. Kvamsdal, & K. M. Okstad (red.), The 16th Nordic Seminar on Computational Mechanics - Proceedings (NSCM 16 udg., s. 155-158). <Forlag uden navn>.
    A. Kristensen, Anders Schmidt. / Cooling of electronic equipment. The 16th Nordic Seminar on Computational Mechanics - Proceedings. red. / K.M. Mathiesen ; T. Kvamsdal ; K.M. Okstad. NSCM 16. udg. <Forlag uden navn>, 2003. s. 155-158
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    abstract = "Cooling of electronic equipment is studied. The design size of electronic equipment decrease causing the thermal density to increase. This affect the cooling which can cause for example failures of critical components due to overheating or thermal induced stresses. Initially a pin fin heat sink is considered as extruded profiles are inadequate for compact designs. An optimal pin fin shape and configuration is sought also taking manufacturing costs into consideration. Standard methods for geometrical modeling and thermal analysis are applied.",
    keywords = "computational mechanics, FEA, FEM, computational mechanics, FEA, FEM",
    author = "{A. Kristensen}, {Anders Schmidt}",
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    A. Kristensen, AS 2003, Cooling of electronic equipment. i KM Mathiesen, T Kvamsdal & KM Okstad (red), The 16th Nordic Seminar on Computational Mechanics - Proceedings. NSCM 16 udg, <Forlag uden navn>, s. 155-158, Nordic Seminar on Computational Mechanics, Trondheim, Norge, 16/10/2003.

    Cooling of electronic equipment. / A. Kristensen, Anders Schmidt.

    The 16th Nordic Seminar on Computational Mechanics - Proceedings. red. / K.M. Mathiesen; T. Kvamsdal; K.M. Okstad. NSCM 16. udg. <Forlag uden navn>, 2003. s. 155-158.

    Publikation: Bidrag til bog/antologi/rapport/konference proceedingKonferenceartikel i proceedingForskning

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    AB - Cooling of electronic equipment is studied. The design size of electronic equipment decrease causing the thermal density to increase. This affect the cooling which can cause for example failures of critical components due to overheating or thermal induced stresses. Initially a pin fin heat sink is considered as extruded profiles are inadequate for compact designs. An optimal pin fin shape and configuration is sought also taking manufacturing costs into consideration. Standard methods for geometrical modeling and thermal analysis are applied.

    KW - computational mechanics

    KW - FEA

    KW - FEM

    KW - computational mechanics

    KW - FEA

    KW - FEM

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    BT - The 16th Nordic Seminar on Computational Mechanics - Proceedings

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    A. Kristensen AS. Cooling of electronic equipment. I Mathiesen KM, Kvamsdal T, Okstad KM, red., The 16th Nordic Seminar on Computational Mechanics - Proceedings. NSCM 16 udg. <Forlag uden navn>. 2003. s. 155-158