Cooling of electronic equipment

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    Abstract

    Cooling of electronic equipment is studied. The design size of electronic equipment decrease causing the thermal density to increase. This affect the cooling which can cause for example failures of critical components due to overheating or thermal induced stresses. Initially a pin fin heat sink is considered as extruded profiles are inadequate for compact designs. An optimal pin fin shape and configuration is sought also taking manufacturing costs into consideration. Standard methods for geometrical modeling and thermal analysis are applied.
    OriginalsprogEngelsk
    TitelThe 16th Nordic Seminar on Computational Mechanics - Proceedings
    RedaktørerK.M. Mathiesen, T. Kvamsdal, K.M. Okstad
    Forlag<Forlag uden navn>
    Publikationsdato2003
    UdgaveNSCM 16
    Sider155-158
    ISBN (Trykt)8274820665
    StatusUdgivet - 2003
    BegivenhedNordic Seminar on Computational Mechanics - Trondheim, Norge
    Varighed: 16 okt. 200318 okt. 2003
    Konferencens nummer: 16

    Konference

    KonferenceNordic Seminar on Computational Mechanics
    Nummer16
    Land/OmrådeNorge
    ByTrondheim
    Periode16/10/200318/10/2003

    Emneord

    • computational mechanics
    • FEA
    • FEM

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