Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities

Masaki Takahashi; Thore Stig Aunsborg; Christian Uhrenfeldt; Stig Munk-Nielsen; Asger Bjørn Jørgensen

doi:10.1109/IWIPP50752.2022.9894237

Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities

Masaki Takahashi^*, Thore Stig Aunsborg, Christian Uhrenfeldt, Stig Munk-Nielsen, Asger Bjørn Jørgensen

^*Kontaktforfatter

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

3 Citationer (Scopus)

166 Downloads (Pure)

Abstract

Determining the reliability of 10 kV SiC-MOSFET power modules experimentally, is challenging due to the low number of samples available in the market. A digital design based on 3D thermal calculations is demonstrated to improve reliability capability in a 10 kV SiC-MOSFET power module. The module design was determined based on the calculation with digital twin modelling. The correctness of the digital twin model was confirmed by fabricating a 10kV SiC-MOSFETs power module sample and comparing the calculation temperature with the measured results. The design was focused on aluminum wires on chips, and the effect of the wire temperature by changing the wire layout was clarified. The results show that the improved wire layout reduces the wire temperature by 2.2-5.3% compared to the conventional design. This is expected to increase the power cycle capability by up to 31%, according to predictions based on the Coffin-Manson model.

Originalsprog	Engelsk
Titel	2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Antal sider	6
Udgivelsessted	Grenoble, France
Forlag	IEEE (Institute of Electrical and Electronics Engineers)
Publikationsdato	24 aug. 2022
Artikelnummer	3
ISBN (Elektronisk)	9781728199337
DOI	https://doi.org/10.1109/IWIPP50752.2022.9894237
Status	Udgivet - 24 aug. 2022
Begivenhed	2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Grenoble, France, Grenoble, Frankrig Varighed: 24 aug. 2022 → 26 aug. 2022

Konference

Konference	2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Lokation	Grenoble, France
Land/Område	Frankrig
By	Grenoble
Periode	24/08/2022 → 26/08/2022

Adgang til dokumentet

10.1109/IWIPP50752.2022.9894237

IWIPP2022_MasakiTakahashiAccepteret manuskript, 793 KB

https://ieeexplore.ieee.org/document/9894237

AUB Link

Søg efter materialet i Aalborg Universitetsbiblioteks søgemaskine

Andre filer og links

Link to publication in Scopus

1 Igangværende
2 Afsluttet

CoDE: Center of Digitalized Electronics (CoDE)
Munk-Nielsen, S. (PI (principal investigator)), Jørgensen, A. B. (CoPI), Uhrenfeldt, C. (CoPI), Beczkowski, S. (Projektdeltager), Ahmad, F. (Projektdeltager), Meinert, J. D. (Projektdeltager), Kubulus, P. P. (Projektdeltager), Takahashi, M. (Projektdeltager), Sun, Z. (Projektdeltager), Wang, R. (Projektdeltager), Gao, Y. (Projektdeltager), Zäch, M. R. (Projektdeltager), Meyer, S. (Projektdeltager), Liccardi, S. (Projektdeltager), Kristensen, N. H. (Projektdeltager) & Steffensen, B. (Projektkoordinator)
Poul Due Jensens Fond
01/01/2021 → 31/12/2026
Projekter: Projekt › Forskning
Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module
Takahashi, M. (PI (principal investigator)), Uhrenfeldt, C. (Supervisor), Munk-Nielsen, S. (Supervisor) & Jørgensen, A. B. (Supervisor)
01/10/2021 → 30/09/2024
Projekter: Projekt › Ph.d.-projekt
MVolt: Medium Voltage Power Electronics for Wind Systems
Munk-Nielsen, S. (PI (principal investigator)), Uhrenfeldt, C. (CoI (co-investigator)), Jørgensen, A. B. (CoI (co-investigator)), Jørgensen, J. K. (CoI (co-investigator)), Beczkowski, S. (Projektdeltager), Bech, M. M. (Projektdeltager), Spender-Andersen, G. (Projektdeltager), Lascu, C. (Projektdeltager), Zhao, H. (Projektdeltager), Dalal, D. N. (Projektdeltager), Kjærsgaard, B. F. (Projektdeltager), Aunsborg, T. S. (Projektdeltager), Jacobsen, J. (Projektdeltager), Mishra, P. (Projektdeltager) & Steffensen, B. (Projektkoordinator)
Innovationsfonden
01/10/2020 → 30/09/2024
Projekter: Projekt › Forskning

Citationsformater

Takahashi, M., Aunsborg, T. S., Uhrenfeldt, C., Munk-Nielsen, S., & Jørgensen, A. B. (2022). Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities. I 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) Artikel 3 IEEE (Institute of Electrical and Electronics Engineers). https://doi.org/10.1109/IWIPP50752.2022.9894237

@inproceedings{12f96d388cc74725bcdb8c959ef39469,

title = "Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities",

abstract = "Determining the reliability of 10 kV SiC-MOSFET power modules experimentally, is challenging due to the low number of samples available in the market. A digital design based on 3D thermal calculations is demonstrated to improve reliability capability in a 10 kV SiC-MOSFET power module. The module design was determined based on the calculation with digital twin modelling. The correctness of the digital twin model was confirmed by fabricating a 10kV SiC-MOSFETs power module sample and comparing the calculation temperature with the measured results. The design was focused on aluminum wires on chips, and the effect of the wire temperature by changing the wire layout was clarified. The results show that the improved wire layout reduces the wire temperature by 2.2-5.3% compared to the conventional design. This is expected to increase the power cycle capability by up to 31%, according to predictions based on the Coffin-Manson model.",

keywords = "10 kV SiC MOSFETs, 3D Thermal Simulation, Digital design, Power cycle, Power module",

author = "Masaki Takahashi and Aunsborg, {Thore Stig} and Christian Uhrenfeldt and Stig Munk-Nielsen and J{\o}rgensen, {Asger Bj{\o}rn}",

year = "2022",

month = aug,

day = "24",

doi = "10.1109/IWIPP50752.2022.9894237",

language = "English",

booktitle = "2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)",

publisher = "IEEE (Institute of Electrical and Electronics Engineers)",

address = "United States",

note = "2022 IEEE International Workshop on Integrated Power Packaging (IWIPP) ; Conference date: 24-08-2022 Through 26-08-2022",

}

Takahashi, M , Aunsborg, TS, Uhrenfeldt, C, Munk-Nielsen, S & Jørgensen, AB 2022, Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities. i 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)., 3, IEEE (Institute of Electrical and Electronics Engineers), Grenoble, France, 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP), Grenoble, Frankrig, 24/08/2022. https://doi.org/10.1109/IWIPP50752.2022.9894237

Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities. / Takahashi, Masaki ; Aunsborg, Thore Stig; Uhrenfeldt, Christian et al.
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP). Grenoble, France: IEEE (Institute of Electrical and Electronics Engineers), 2022. 3.

Publikation: Bidrag til bog/antologi/rapport/konference proceeding › Konferenceartikel i proceeding › Forskning › peer review

TY - GEN

T1 - Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities

AU - Takahashi, Masaki

AU - Aunsborg, Thore Stig

AU - Uhrenfeldt, Christian

AU - Munk-Nielsen, Stig

AU - Jørgensen, Asger Bjørn

PY - 2022/8/24

Y1 - 2022/8/24

N2 - Determining the reliability of 10 kV SiC-MOSFET power modules experimentally, is challenging due to the low number of samples available in the market. A digital design based on 3D thermal calculations is demonstrated to improve reliability capability in a 10 kV SiC-MOSFET power module. The module design was determined based on the calculation with digital twin modelling. The correctness of the digital twin model was confirmed by fabricating a 10kV SiC-MOSFETs power module sample and comparing the calculation temperature with the measured results. The design was focused on aluminum wires on chips, and the effect of the wire temperature by changing the wire layout was clarified. The results show that the improved wire layout reduces the wire temperature by 2.2-5.3% compared to the conventional design. This is expected to increase the power cycle capability by up to 31%, according to predictions based on the Coffin-Manson model.

AB - Determining the reliability of 10 kV SiC-MOSFET power modules experimentally, is challenging due to the low number of samples available in the market. A digital design based on 3D thermal calculations is demonstrated to improve reliability capability in a 10 kV SiC-MOSFET power module. The module design was determined based on the calculation with digital twin modelling. The correctness of the digital twin model was confirmed by fabricating a 10kV SiC-MOSFETs power module sample and comparing the calculation temperature with the measured results. The design was focused on aluminum wires on chips, and the effect of the wire temperature by changing the wire layout was clarified. The results show that the improved wire layout reduces the wire temperature by 2.2-5.3% compared to the conventional design. This is expected to increase the power cycle capability by up to 31%, according to predictions based on the Coffin-Manson model.

KW - 10 kV SiC MOSFETs

KW - 3D Thermal Simulation

KW - Digital design

KW - Power cycle

KW - Power module

UR - http://www.scopus.com/inward/record.url?scp=85141514271&partnerID=8YFLogxK

U2 - 10.1109/IWIPP50752.2022.9894237

DO - 10.1109/IWIPP50752.2022.9894237

M3 - Article in proceeding

BT - 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)

PB - IEEE (Institute of Electrical and Electronics Engineers)

CY - Grenoble, France

T2 - 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)

Y2 - 24 August 2022 through 26 August 2022

ER -

Takahashi M , Aunsborg TS, Uhrenfeldt C, Munk-Nielsen S , Jørgensen AB. Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities. I 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP). Grenoble, France: IEEE (Institute of Electrical and Electronics Engineers). 2022. 3 doi: 10.1109/IWIPP50752.2022.9894237

Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities

Abstract

Konference

Adgang til dokumentet

AUB Link

Andre filer og links

Fingeraftryk

Projekter

CoDE: Center of Digitalized Electronics (CoDE)

Developing the Novel Reliability Design Method with 3D-simulation of SiC Power Module

MVolt: Medium Voltage Power Electronics for Wind Systems

Citationsformater