Editorial

Mauro Ciappa; Paolo Cova; Gaudenzio Meneghesso; Francesco Iannuzzo

doi:10.1016/j.microrel.2018.09.003

Editorial

Mauro Ciappa, Paolo Cova, Gaudenzio Meneghesso, Francesco Iannuzzo

Publikation: Bidrag til tidsskrift › Leder › peer review

Abstract

This Special Issue of Microelectronics Reliability includes the peer-reviewed manuscripts of all contributions presented at the 29thEuropean Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018) held in Aalborg (Denmark), from October 1 to October 5, 2018.

Originalsprog	Engelsk
Tidsskrift	Microelectronics Reliability
Vol/bind	88-90
Sider (fra-til)	1-1
Antal sider	1
ISSN	0026-2714
DOI	https://doi.org/10.1016/j.microrel.2018.09.003
Status	Udgivet - sep. 2018
Begivenhed	29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - AKKC, Aalborg, Danmark Varighed: 1 okt. 2018 → 5 okt. 2018 Konferencens nummer: 29th http://www.esref2018conf.org/

Konference

Konference	29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Nummer	29th
Lokation	AKKC
Land/Område	Danmark
By	Aalborg
Periode	01/10/2018 → 05/10/2018
Internetadresse	http://www.esref2018conf.org/

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10.1016/j.microrel.2018.09.003

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Citationsformater

@article{5defc610b682466aa7d894a8dc742c18,

title = "Editorial",

abstract = "This Special Issue of Microelectronics Reliability includes the peer-reviewed manuscripts of all contributions presented at the 29thEuropean Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018) held in Aalborg (Denmark), from October 1 to October 5, 2018.",

author = "Mauro Ciappa and Paolo Cova and Gaudenzio Meneghesso and Francesco Iannuzzo",

year = "2018",

month = sep,

doi = "10.1016/j.microrel.2018.09.003",

language = "English",

volume = "88-90",

pages = "1--1",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Pergamon Press",

note = "29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2018 ; Conference date: 01-10-2018 Through 05-10-2018",

url = "http://www.esref2018conf.org/",

}

TY - JOUR

T1 - Editorial

AU - Ciappa, Mauro

AU - Cova, Paolo

AU - Meneghesso, Gaudenzio

AU - Iannuzzo, Francesco

N1 - Conference code: 29th

PY - 2018/9

Y1 - 2018/9

N2 - This Special Issue of Microelectronics Reliability includes the peer-reviewed manuscripts of all contributions presented at the 29thEuropean Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018) held in Aalborg (Denmark), from October 1 to October 5, 2018.

AB - This Special Issue of Microelectronics Reliability includes the peer-reviewed manuscripts of all contributions presented at the 29thEuropean Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018) held in Aalborg (Denmark), from October 1 to October 5, 2018.

UR - http://www.scopus.com/inward/record.url?scp=85054023728&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.09.003

DO - 10.1016/j.microrel.2018.09.003

M3 - Editorial

AN - SCOPUS:85054023728

SN - 0026-2714

VL - 88-90

SP - 1

EP - 1

JO - Microelectronics Reliability

JF - Microelectronics Reliability

T2 - 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

Y2 - 1 October 2018 through 5 October 2018

ER -

Editorial

Abstract

Konference

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